Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders

Chuang, Cheng-Li; Tsao, L. C.

doi:10.1007/s10854-017-8354-8

Cited by 8 publications

(2 citation statements)

References 34 publications

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“…Grain size of Ag3Sn IMCs and spacing between them decreased, and enhanced microhardness was also reported [7]. In the case of SnAg3.5Zn0.5 solder, the addition of TiO2 and Al2O3 elevated the melting point of the composite solder and decreased the melting range [8]. The addition of TiO2 (up to 1 wt%) in SnZn6.5 solder alloy resulted in higher creep resistance and increased melting temperature, and refined grain sizes of primary β-Sn [9].…”

Section: Introductionmentioning

confidence: 86%

Soldering with SACX0307-(TiO₂/ZnO) nano-composite solder alloys

Illés

Skwarek

Krammer

et al. 2021

2021 44th International Spring Seminar on Electronics Technology (ISSE)

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In the present research, the solderability of SACX0307 nano-composite solder alloys was studied. The SACX0307 solder alloys were reinforced by ZnO or TiO2 nanoparticles. The nanoparticles were mixed into the solder paste in different volume fractions between 0.25 and 1 wt%, using the ball milling process. Wetting and mechanical tests were performed with the nano-composite solder alloys and with the reference SACX0307 as well. It was found that the ceramic reinforcements did not have a considerable effect on the wetting of the composite solder alloys. However, the shear strength of the nano-composite solder joints increased compared to the reference SACX0307. Generally, the application of TiO2 nanoparticles resulted in a bit better solderin properties than the ZnO nanoparticles. No straightforward correlation was found between the volume fraction of the ceramic nanoparticles and the soldering properties of the nano-composite solder alloys. Expect in the case of the ZnO nanoparticles, when the volume fraction should not exceed 0.5wt% since it can inhibit the proper reflow of the solder paste.

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Section: Introductionmentioning

confidence: 86%

Soldering with SACX0307-(TiO₂/ZnO) nano-composite solder alloys

Illés

Skwarek

Krammer

et al. 2021

2021 44th International Spring Seminar on Electronics Technology (ISSE)

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“…Moreover the addition of TiO2 nano-particles could also decrease the Ag3Sn grain size and the interphase spacing between them, which resulted in further microhardness enhancement [6]. An unfavorable side effect of the TiO2 addition can be the increase of the melting point of the composite solder alloy [7]; however, it is usually only some Kelvin [8]. Furthermore, the ceramic particles can marginally increase the resistance of the solder joints.…”

Section: Introductionmentioning

confidence: 99%

Properties of nano-composite SACX0307-(ZnO, TiO₂) solders

Illés

Skwarek

Krammer

et al. 2021

2021 23rd European Microelectronics and Packaging Conference &Amp; Exhibition (EMPC)

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In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.

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