Abstract:The effects of total surface roughness of Cu bond layers and applied load during bonding on the bond strength and the contact resistance of the bonded interface were studied for three-dimensional (3D) devices. The 3D structures were fabricated by thermocompression bonding of two wafers, each fabricated with a Cu damascene process. The average bond strength of the samples was found to increase with increasing load, and with decreasing roughness. On the other hand, the average contact resistance increased as the… Show more
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