Effects of multiple trace alloying elements on the microstructure and properties of Cu-4 wt% Ti alloys

Wei, Huan; Cui, Yan-chao; Cui, Huiqi; Wei, Yinghui; Hou, Lifeng

doi:10.1016/j.msea.2017.09.072

Cited by 33 publications

(13 citation statements)

References 38 publications

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“…The formation of the Fe2Ti and the (FeCr)2Ti phases could decrease the number of Titanium atoms in the Cu matrix. Therefore, even though the Fe2Ti and the (FeCr)2Ti phases played some part in the grain refinement and the precipitate strengthening processes, the hardness of the Cu-3Ti alloy was still higher than the Cu-Ti-Fe and the Cu-Ti-Fe-Cr alloys, which was consistent with that found in Reference [3], and was ascribed to the stronger solution strengthening effect of the Titanium atoms.…”

Section: Mechanical Propertiessupporting

confidence: 87%

“…Age-hardenable Cu-based alloys, which have good mechanical and electrical properties, are widely used in components of various electronic devices, such as connectors, relays, and switches [1][2][3][4][5][6][7]. Recent rapid advances of densely-integrated and the reductions in size and thickness of electronic components have led to more severe requirements for excellent mechanical and electrical properties of the Cu-based alloys.…”

Section: Introductionmentioning

confidence: 99%

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Effects of Trace Alloying Elements Fe and Cr on the Microstructure and Aging Properties of Cu-3Ti Alloy Foils

Zhao

Dong

et al. 2018

Metals

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In this work, the effects of an addition of trace alloying elements, Fe and Cr, on the mechanical and electrical properties and corrosion resistance of Cu-3Ti alloy foils, have been investigated. The results showed that the individual addition of Fe leads to the formation of Fe2Ti intermetallic phase, which refines the grain size, in the solution-treated condition. With a combined addition of Fe and Cr, the formation of the (FeCr)2Ti phase and the precipitation of the β′-Cu4Ti phase resulted in increased hardness in the peak-aged condition. The ultimate tensile strength and yield strength of the peak-aged Cu-Ti-Fe-Cr alloy were 13% and 5.7% higher, than those of the Cu-3Ti alloy, respectively. The electrical conductivity of the peak-aged Cu-Ti-Fe-Cr alloy was 3.3% higher than that of the Cu-Ti-Fe alloy, due to the finer (FeCr)2Ti phase and the less residual Ti atoms, in the Cu matrix. The combined addition of Fe and Cr elements could improve the corrosion resistance of the Cu-Ti alloy. The Cu-Ti-Fe-Cr alloy foil could obtain the best integrated properties, and the hardness, ultimate tensile strength, and electrical conductivity were 357.1 HV, 1068 MPa and 12.5% IACS, respectively.

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Section: Mechanical Propertiessupporting

confidence: 87%

Section: Introductionmentioning

confidence: 99%

Effects of Trace Alloying Elements Fe and Cr on the Microstructure and Aging Properties of Cu-3Ti Alloy Foils

Zhao

Dong

et al. 2018

Metals

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“…Figure 16 shows the comparison of tensile strength and electrical conductivity of Cu-Ni-Si system alloys and other kinds of copper alloys such as Cu-Be [34,35,36], Cu-Ti [37,38,39,40], Cu-Sn [41,42], Cu-Cr [24,43,44], Cu-Zr [45,46,47], Cu-Zn-Sn [48,49], and Cu-Cr-Zr [50,51]. The current development trend of copper alloys is mainly divided in three directions.…”

Section: Discussionmentioning

confidence: 99%

Effect of Ni/Si Mass Ratio and Thermomechanical Treatment on the Microstructure and Properties of Cu-Ni-Si Alloys

Li¹,

Huang²,

Mi³

et al. 2019

Materials

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The effect of the Ni/Si mass ratio and combined thermomechanical treatment on the microstructure and properties of ternary Cu-Ni-Si alloys is discussed systematically. The Cu-Ni-Si alloy with a Ni/Si mass ratio of 4–5 showed good comprehensive properties. Precipitates with disc-like shapes were confirmed as the Ni2Si phase with orthorhombic structure through transmission electron microscopy, high-resolution transmission electron microscopy, and 3D atom probe characterization. After the appropriate thermomechanical treatment, the studied alloy with a Ni/Si mass ratio of 4.2 exhibited excellent mechanical properties: a hardness of 290 HV, tensile strength of 855 MPa, yield strength of 782 MPa, and elongation of 4.5%. Compared with other approaches, the thermomechanical treatment increased the hardness and strength without sacrificing electrical conductivity. Theoretical calculations indicated that the high strength was primarily attributed to the Orowan precipitation strengthening and secondarily ascribed to the work hardening, which were highly consistent with the experimental results. The appropriate Ni/Si mass ratio with a low content of Ni and Si atoms shows high strength and excellent electrical conductivity through combined thermomechanical treatment. This work provides a guideline for the design and preparation of multicomponent Cu-Ni-Si-X alloys with ultrahigh strength and excellent electrical conductivity.

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“…How to enhance the strength sharply while keeping the high conductivity of copper as far as possible becomes the important issue in the development of the modern copper processing industry [5]. One of the most common methods to improve the mechanical properties of copper is to add solid solution elements, such as Ti [6], Ni [7], Si [8], and Cr [9] etc. Although this sort of alloy elements could endow copper alloys with higher strength, their conductivity is typically reduced.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Wang

Zou

et al. 2019

Materials

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Cu-2.4 wt.%V nanocomposite has been prepared by mechanical alloy and vacuum hot-pressed sintering technology. The composites were sintered at 800 °C, 850 °C, 900 °C, and 950 °C respectively. The microstructure and properties of composites were investigated. The results show that the Cu-2.4 wt.%V composite presents high strength and high electrical conductivity. The composite sintered at 900 °C has a microhardness of 205 HV, a yield strength of 404.41 MPa, and an electrical conductivity of 79.5% International Annealed Copper Standard (IACS); the microhardness and yield strength reduce gradually with the increasing consolidation temperature, which is mainly due to the growth of copper grain size. After sintering, copper grain size and V nanoparticle both maintain in nanoscale; the strengthening mechanism is related to grain boundary strengthening and dispersion strengthening, while the grain boundary strengthening mechanism plays the most important role. This study indicates that the addition of small amounts of V element could enhance the copper matrix markedly with the little sacrifice of electrical conductivity.

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Effects of multiple trace alloying elements on the microstructure and properties of Cu-4 wt% Ti alloys

Cited by 33 publications

References 38 publications

Effects of Trace Alloying Elements Fe and Cr on the Microstructure and Aging Properties of Cu-3Ti Alloy Foils

Effects of Trace Alloying Elements Fe and Cr on the Microstructure and Aging Properties of Cu-3Ti Alloy Foils

Effect of Ni/Si Mass Ratio and Thermomechanical Treatment on the Microstructure and Properties of Cu-Ni-Si Alloys

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

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