Effects of monomer structure and imidization degree on mechanical properties and viscoelastic behavior of thermoplastic polyimide films

BPDA-PDA Polyimide: Synthesis, Characterizations, Aging and Semiconductor Device Passivation

“…The characteristic IR absorption peaks were assigned thanks to previous works [17,[26][27][28][29][30][31][32][33][34][35][36]. Usually, PAA spectra are compound of the N-H stretch bonds at 2900-3200 cm -1 , the C=O carbonyl stretch from carboxylic acid at 1710-1720 cm -1 , the symmetric carboxylate stretch bonds at 1330-1415 cm -1 , the C=O carbonyl stretch of the amide I mode around 1665 cm -1 , the 1540-1565 cm -1 amide II mode and the 1240-1270 cm -1 band due to the C-O-C ether aromatic stretch (if present in the monomer).…”

Processing of Carbon Fiber/PEI Composites Based on Aqueous Polymeric Suspension of Polyimide

“…These applications are possible due to the many advantageous properties exhibited by polyimides, including excellent mechanical, thermal and adhesive properties, good radiation resistance, low dielectric constant, chemical resistances, there are no known organic solvent for the aromatic polyimides, and it has been used successfully in applications at temperatures as low as -269 o C and as high as 400 o C (Ghosh & Mittal, 1996;Saeed & Zhan, 2006;Srinivas et al, 1997).…”

Processing of high performance composites based on peek by aqueous suspension prepregging

“…Polyimides (PIs) are a class of thermally stable high-performance polymers that continue to gain importance in a wide variety of applications such as high-temperature adhesives, microelectronics, membranes, photosensitive materials, matrix materials for composites and as reinforcement coating [3][4][5][6][7][8][9] . These applications are possible due to the many advantageous properties exhibited by polyimides, including excellent mechanical, thermal and adhesive properties, good radiation and chemical resistances, and low dielectric constant [9][10][11][12] . In the case of composite applications, PIs have been successfully used as reinforcement coating and interface between carbon fibers and high-performance thermoplastic matrices such as PEEK, poly(etherimide) and poly(phenylene sulfide) 13 .…”