Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish

Huang, Zonghao; Kumar, Praveen; Dutta, I.; Sidhu, R. S.; Renavikar, M.; Mahajan, Ravi

doi:10.1007/s11664-014-3441-6

Cited by 7 publications

(2 citation statements)

References 29 publications

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“…From Table 4, it can be seen that, NPK fertilizer combined with organic materials can play a positive role in improving maize yield (Huang et al, 2014). Compared with the control, the difference reaches a very significant level.…”

Section: Discussion Of Effects Of Combined Application Of Different mentioning

confidence: 93%

Effects of physicochemical properties of different substrates on characters and yield of maize

Yang

2018

Emir J Food Agric

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A reasonable method was used to analyze the effects of different substrates on the characters and yield of maize, and to improve the quality and yield of maize. The effects of the maize characters and yield of national Fluvo-aquic soil fertility and fertilizer efficiency monitoring base were analyzed from 6 aspects: fertilization and combined application, fertilization and density coupling, controlled release fertilizer (CRF), fertilization level, fertilization depth and proportion, and the amount of organic manure (chicken manure). Data processing is done by using Excel2003 and SPSS17.0 software, and multiple comparisons are made by using Duncan’s new multiple range test method. The experiment of the influence factor of fertilization and combined application shows that the combination of NPK+ organic fertilizer (constant and high) can increase maize character ratio and NPK+ high-amount organic manure can increase maize yield. The experiment of the influence factor of fertilization and density coupling shows that the maize characters reached the optimum under the condition of high fertilizer. The yield of maize is highest when the density is 60000 plants /hm2 and the amount of fertilizer is 10.71kg, 3.57kg and 8.93kg per 667m2. The experiment of the influence factor of controlled release fertilizer shows that the characters of CRF V and CRF VI are the best. The control time of CRF III, CRF V, CRF VI, and CRF IV compound fertilizer is long, which can increase maize yield. The experiment of the influence factor of fertilizer level shows that the best character of maize is achieved by using the controlled release fertilizer of Agricultural University 450 kg/hm2 and two-topdressing 600 kg/hm2. In the process of corn production, the use of A-40 treatment (Volfertile controlled release fertilizer 600kg/hm2) and the one-time application of base fertilizer can increase the yield of maize. The experiment of the influence factor of fertilization depth and proportion show that the best combination is that seed fertilizer 20% urea, 40% diammonium phosphate and potassium sulfate were applied under the surface of 8cm and base fertilizer 40% urea, 60% diammonium phosphate and potassium sulfate were applied under the surface of 16cm. It can improve the character and yield of maize at the same time. The experiment of the influence factor of organic manure (chicken manure) shows that the amount of organic fertilizer (chicken manure) 26923kg per hectare with fertilizing 35kg per plot is the best amount of fertilizer, and the yield of maize increases. The proposed method can comprehensively and accurately analyze the effects of different substrates on the character and yield of maize, which can promote rational fertilization in maize and improve the quality and yield of maize steadily.

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Section: Discussion Of Effects Of Combined Application Of Different mentioning

confidence: 93%

Effects of physicochemical properties of different substrates on characters and yield of maize

Yang

2018

Emir J Food Agric

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“…1 They pointed out that the Cu 6 Sn 5 and Cu 3 Sn layer formed in the Sn-Cu-Ag/Cu, while (Ni, Cu) 3 Sn 4 IMC formed in the SAC/ENIG, and that postisothermal ageing, the growth rate of the interfacial IMC on the Cu substrate was 3.3 times faster relative to that of the ENIG substrate, resulting in a thicker interfacial IMC layer. Huang et al 2 reported that the Sn-3.8Ag-0.7Cu on the ENIG surface finish resulted in a stronger solder joint reliability relative to that of the Cu-OSP substrate, where the IMC interfacial morphology formed in spallation and the discontinuity layer. Also, Kim et al 3 reported that the solder joint of Sn-3.0Ag-0.5Cu on the ENIG substrate possessed excellent electromigration reliability relative to that of the Cu-OSP and the immersion Sn surface finish due to the effective diffusion barrier provided by the nickel (Ni) layer in ENIG.…”

Section: Introductionmentioning

confidence: 99%

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Amli

Salleh

Ramli

et al. 2020

Journal of Elec Materi

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This study examines factor(s) behind the formation of primary Cu 6 Sn 5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys are hypoeutectic. To understand the contribution from copper (Cu) dissolution from the substrate a Cu-free alloy, tin-3.5 silver (Sn-3.5Ag), was used as a soldered-on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish substrates. Microstructure observations including in situ synchrotron were used to observe microstructure development real-time and confirm the time and location for nucleation of primary Cu 6 Sn 5 . High-speed shear tests were performed to determine the solder joint's strengths. The results confirm that Cu dissolution during soldering is responsible for the formation of primary Cu 6 Sn 5 . The ENIG finish prevented Cu dissolution and the formation of Cu 6 Sn 5 resulting in higher solder joint strength for the Sn-3.5Ag/ENIG solder joints. The findings can be used to understand the evolution of primary Cu 6 Sn 5 and how it can be suppressed to improve joint strength.

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Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

Talebanpour

Huang

Chen

et al. 2015

Journal of Elec Materi

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Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish

Cited by 7 publications

References 29 publications

Effects of physicochemical properties of different substrates on characters and yield of maize

Effects of physicochemical properties of different substrates on characters and yield of maize

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Effect of Joint Scale and Processing on the Fracture of Sn-3Ag-0.5Cu Solder Joints: Application to Micro-bumps in 3D Packages

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