2021
DOI: 10.1016/j.msea.2021.141581
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Effects of microelements on the microstructure evolution and properties of ultrahigh strength Cu–Ti alloys

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Cited by 39 publications
(3 citation statements)
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“…Figure 9 shows that the critical condition has a linear relationship with the lnZ under different hot deformation conditions, and the expressions are shown in Equation ( 13) and ( 14) ln ε c ¼ À16.2693 þ 0.31817 lnZ (13) ln σ c ¼ À4.0096 þ 0.2009 lnZ (14)…”
Section: Critical Stress-strain Conditionmentioning
confidence: 99%
See 1 more Smart Citation
“…Figure 9 shows that the critical condition has a linear relationship with the lnZ under different hot deformation conditions, and the expressions are shown in Equation ( 13) and ( 14) ln ε c ¼ À16.2693 þ 0.31817 lnZ (13) ln σ c ¼ À4.0096 þ 0.2009 lnZ (14)…”
Section: Critical Stress-strain Conditionmentioning
confidence: 99%
“…[ 12 ] Huang et al systematically manufactured and studied high‐strength and high‐ductility Cu‐Ti‐Cr alloys, and found that increasing Ti and Cr contents can improve the strength and plasticity of the samples, where precipitation strengthening is the main strengthening mechanism. [ 13 ] Liu et al studied the microstructure of discontinuous precipitates during the aging process of Cu‐Ti‐Fe alloy and found the strengthening and refining of Laves C 14 , as well as the effect of inhibiting discontinuous precipitation. [ 14 ] Xie et al investigated the dynamic recrystallization (DRX) nucleation process at grain junctions of GH4720Li superalloy, it is found that DRX nucleation priorities of the same kind of grain junctions strongly depended on the orientation of the component grains.…”
Section: Introductionmentioning
confidence: 99%
“…it is difficult to simultaneously achieve high strength and good electrical conductivity for Cu-ti alloy. hence, it poses a challenge for material researchers to improve its electrical conductivity while its excellent mechanical properties can be still maintained [16]. thus far, a number of investigations shows that it is an effective measure to incorporate trace alloying elements in the Cu-ti alloy, such as Fe [17], Cr [18], Co [14,19], Cd [20], Sn [21], al [22], P [23], which can reduce the ti solid solution in the Cu matrix and form the intermetallic compounds, thereby reducing electron scattering and improving the electrical conductivity.…”
Section: Introductionmentioning
confidence: 99%