2006
DOI: 10.1063/1.2357155
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Effects of metal penetration into organic semiconductors on the electrical properties of organic thin film transistors

Abstract: Independently driven four-probe method for local electrical characteristics in organic thin-film transistors under controlled channel potential Rev. Sci. Instrum. 82, 093902 (2011); 10.1063/1.3637489 Integration of reduced graphene oxide into organic field-effect transistors as conducting electrodes and as a metal modification layer Appl. Phys. Lett. 95, 023304 (2009); 10.1063/1.3176216 Impact of semiconductor/contact metal thickness ratio on organic thin-film transistor performance Appl. Phys. Lett. 92, 15330… Show more

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Cited by 98 publications
(69 citation statements)
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“…[ 26 ] To prove the presence of trapped charges is due to the Ag layer, the following TAPC hole-only devices were fabricated: at a reverse bias of -0.5 V, indicating that the TAPC hole-only device is electrically shorted due to the penetration of Ag atoms, and this is a commonly known problem encountered in Ag evaporation. [27][28][29][30] To alleviate this shorting problem, Device 2 with a 10% Ag-doped TAPC sandwiched between the two undoped TAPC layers was fabricated. In this device, Al is used as the electrode.…”
Section: Gain Mechanism In Photodetectormentioning
confidence: 99%
“…[ 26 ] To prove the presence of trapped charges is due to the Ag layer, the following TAPC hole-only devices were fabricated: at a reverse bias of -0.5 V, indicating that the TAPC hole-only device is electrically shorted due to the penetration of Ag atoms, and this is a commonly known problem encountered in Ag evaporation. [27][28][29][30] To alleviate this shorting problem, Device 2 with a 10% Ag-doped TAPC sandwiched between the two undoped TAPC layers was fabricated. In this device, Al is used as the electrode.…”
Section: Gain Mechanism In Photodetectormentioning
confidence: 99%
“…[8] At smaller channel dimensions, the scenario is further complicated by the fact that the morphological characteristics -such as grains and grain boundaries -are often on the length-scale of device dimensions. Changes in morphology induced by electrode/dielectric interfaces of semiconductor material deposited on bottom-contact structures do not scale appropriately, while heat damage from metal deposition, the introduction of metal into the channel region, [9] and dependence upon active-layer thickness [10,11] plague top-contact devices [12] . Furthermore, ample evidence indicating that traps at grain boundaries lead to thermally or bias-activated mobility and/or access resistance make clear that the detailed characterization of contact effects is difficult or impossible to extract from devices employing polycrystalline films.…”
Section: Introductionmentioning
confidence: 99%
“…In particular, bis-PCBM is expected to exhibit an increased R Contact /R Channel ratio in comparison to the other fullerenes, which we do not observe for all voltages. Additional details of the injection interface, such as variations in the metal penetration into the semiconductor during top contact deposition 45 and dipole formation at the metal-fullerene interface modifying the effective injection barrier 46 may be influencing these results, among other effects. 44 Further analysis of the charge injection/extraction mechanism is clearly required for a full understanding of this discrepancy but is beyond the scope of the current report and will not be addressed further here.…”
Section: Field-effect Transistors Measurementsmentioning
confidence: 99%