Abstract:Effects of mechanical properties of Cu/Cr metal films on the peel strength of Cr/PI interfaces have been studied. Cr and Cu thin films were successively sputter-deposited on in-situ RF plasma-treated polyimides, and 20 lmi-thick Cu was electroplated. With increasing the yield strength of Cu/Cr films from 156 MPa to 325 MPa, peel strength of Cr/PMDA-ODA and Cr/BPDA-PDA were lowered from 75 g/mam to 57 g/mm and from 69 g/mm to 20 g/mm, respectively. With identical Cu/Cr metal films, lower peel strength was obtai… Show more
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