Effects of laser surface modification on the adhesion strength and fracture mechanism of electroless-plated coatings

Microstructure and mechanical property of thick Cu/AlN joints formed at low temperature

“…[1][2][3][4] The increase of the thickness of Cu improves the current carrying capacity in high-power devices, like the insulated gate bipolar transistor module in new energy automobile and 5G communication. 5,6 In most of the reported works, [7][8][9] the thickness of Cu is less than 1 mm in Cu/ceramic joint. Here, we consider the Cu with a thickness of higher than 1 mm as thick Cu.…”

“…Various bonding methods for Cu and ceramic, such as direct bonding copper, 1,7,14,15 direct plating copper, 8,16 active metal bonding, 10,12 and laser activation metallization 9,17 which limits the current carrying capacity. In direct plating copper technology, the ceramic is first surface modified by vacuum sputtering, and then electro-plated Cu is made on the ceramic via chemical bonding at a low temperature of ∼300 • C. 8 The thickness of Cu is limited to below 1 mm for a low plating rate of several µm/h.…”

“…Various bonding methods for Cu and ceramic, such as direct bonding copper, 1,7,14,15 direct plating copper, 8,16 active metal bonding, 10,12 and laser activation metallization 9,17 technologies, have been reported. The most used method is direct bonding copper technology.…”

SELECTING A SURFACE PREPARATION TREATMENT ON A MEDIUM ENTROPY Ti-Zr-Ta-Ag ALLOY

“…The performance of the coated alloy can be greatly influenced by the employed surface pretreatment [24][25][26][27], therefore a careful investigation of this intermediate step can bring much benefits. It is the novelty of the present manuscript and is aim as well to develop and investigate the alloy surfaces treated in different ways to select the one with better characteristics.…”