2008
DOI: 10.1080/10426910701774726
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Effects of Key Process Conditions on Warpage and Via Protrusion of LTCC Substrate

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Cited by 6 publications
(2 citation statements)
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“…The form accuracy of a large-area epoxy resin mold before the post cure is 147 µm whereas the form accuracy of a large-area epoxy resin mold after a post cure is approximately 264 µm. This phenomenon explains no significant global warpage of a large-area epoxy resin mold after a post cure was observed [21]. Fig.…”
Section: Methodsmentioning
confidence: 81%
“…The form accuracy of a large-area epoxy resin mold before the post cure is 147 µm whereas the form accuracy of a large-area epoxy resin mold after a post cure is approximately 264 µm. This phenomenon explains no significant global warpage of a large-area epoxy resin mold after a post cure was observed [21]. Fig.…”
Section: Methodsmentioning
confidence: 81%
“…Increasing the number of layers makes warpage worse due to these mismatches. The development of stresses resulting from the differential shrinkage of different materials, irregular shapes and asymmetric temperatures in the furnace can lead to defects such as camber or warpage, which can reduce the production yield (Zhong et al , 2008).…”
Section: Warpagementioning
confidence: 99%