Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

Kim, K.S.; Huh, Seok-Hwan; Suganuma, Katsuaki

doi:10.1016/s0925-8388(02)01166-0

Cited by 571 publications

(255 citation statements)

References 19 publications

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“…free, in consumer electronic products, the study of the wetting reaction of 9 molten solder on Cu has attracted considerable interests. 1-Metallic bonding in solder joints is achieved through the formation of Cu-Sn intermetallic compounds of Cu 6 Sn 5 and Cu 3 Sn at the Cu/solder interface.…”

mentioning

confidence: 99%

Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu

Suh

Tamura

2007

Applied Physics Letters

101

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Wetting reaction between molten Sn-based solders and Cu produces scallop-type Cu6Sn5. In the present wetting study, a (001) single crystal Cu is used as substrate and a dramatic change in the morphology of Cu6Sn5 is observed: instead of scallop type, the authors observed a rooftop-type Cu6Sn5 grains, elongated along two preferred orientation directions. This was confirmed by electron beam backscattered diffraction and white beam synchrotron x-ray microdiffraction. The results indicate that the nucleation, growth, and ripening behavior of Cu6Sn5 on single crystal substrate can be quite different from the conventional case of wetting on randomly oriented polycrystalline Cu substrates.

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mentioning

confidence: 99%

Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu

Suh

Tamura

2007

Applied Physics Letters

101

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“…The addition of Cu slightly depresses the melting temperature of Sn-Ag and increases the wetting behavior (Kim et al 2003). Rosalbino et al (2009) investigated the corrosion behavior of Sn-Pb, SnAg-In and Sn-Ag-Bi alloys and reported poor corrosion behavior of Sn-Ag-In and Sn-Ag-Bi alloys as compared to that of Sn-Pb.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Fayeka¹,

Haseeb²,

Fazal³

2017

JSM

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Sn-Ag based solder alloy seems to be a promising lead-free solder for the application on electronic assembly. The corrosion behavior of different lead free solder alloys such as Aloi pateri berasaskan Sn-Ag berpotensi menjadi pateri bebas-Pb untuk diaplikasikan sebagai pemasangan elektronik. Tindak balas kakisan aloi pateri bebas Pb yang berbeza seperti dikaji dalam larutan 3.5% NaCl menggunakan upaya dinamik pengutuban dan spektroskopi impedans elektrokimia. Mikroskop imbasan elektron (SEM), spektroskopi sinar-X tenaga terserak (EDX) dan pembelauan sinar-X (XRD) telah digunakan

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“…To produce such products, it requires a larger number of input and output data which can be obtained through a good solder joint connection [1][2][3]. Nevertheless, the solder joint need to be controlled due to the existence of IMC, whereby excessive growth or unexpected morphological change of IMC may be detrimental to the solder joint performance which finally leads to failure [4,5].…”

Section: Introductionmentioning

confidence: 99%

Effect of Flux onto Intermetallic Compound Formation and Growth

2016

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Abstract. In this study, the effect of different composition of no-clean flux onto intermetallic compound (IMC) formation and growth was investigated. The solder joint between Sn-3Ag-0.5Cu solder alloy and printed circuit board (PCB) was made through reflow soldering. They were further aged at 125oC and 150oC for up to 1000 hours. Results showed that fluxes significantly affect the IMC thickness and growth. In addition, during aging, the scallop and columnar morphology of IMC changed to a more planar type for both type of flux during isothermal aging. It was observed that the growth behavior of IMC was closely related to initial soldering condition.

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Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints

Cited by 571 publications

References 19 publications

Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu

Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu

Electrochemical Corrosion Behaviour of Pb-free SAC 105 and SAC 305 Solder Alloys: A Comparative Study

Effect of Flux onto Intermetallic Compound Formation and Growth

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