Effects of integrated circuit packaging on performance of a LNA in a mixed-signal circuit environment

A simulation-based design method to transfer surface mount RF system to flip-chip die implementation

“…Lots of efforts were spent to characterize the performance of flipchip [1] [2], to build its equivalent model [3] [4] and to investigate the packaging effects [5]. Some applications such as flip-chip transition [6] were developed based on the knowledge and understanding of the flip-chip interconnection to make good use of flip-chip's advantages.…”