Effects of Heatsink Application and PCB Design Variations on BGA Solder Joint Reliability

Ahmed, Omar; Hutchinson, Leif; Su, Peng; Jiang, Tengfei

doi:10.1109/ectc32696.2021.00164

Cited by 3 publications

(1 citation statement)

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“…It was found that cracking of the solder joint occurred mainly at the interface between the RDL layer and the bulk solder. Ahmed et al [ 23 ] performed nonlinear FE analyses using a global and sub-model modeling technique to analyze and assess the effects of heat sink application and the PCB laminate material properties on the solder joint reliability of 2.5D lidless structures. The simulation results showed that the solder joint reliability increased without the heat sink, with a thinner PCB thickness, and lower coefficient of temperature expansion (CTE) of the PCB laminate.…”

Section: Introductionmentioning

confidence: 99%

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

et al. 2023

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Flip Chip Ball Grid Array (FCBGA) packages, together with many other heterogeneous integration packages, are widely used in high I/O (Input/Output) density and high-performance computing applications. The thermal dissipation efficiency of such packages is often improved through the use of an external heat sink. However, the heat sink increases the solder joint inelastic strain energy density, and thus reduces the board-level thermal cycling test reliability. The present study constructs a three-dimensional (3D) numerical model to investigate the solder joint reliability of a lidless on-board FCBGA package with heat sink effects under thermal cycling testing, in accordance with JEDEC standard test condition G (a thermal range of −40 to 125 °C and a dwell/ramp time of 15/15 min). The validity of the numerical model is confirmed by comparing the predicted warpage of the FCBGA package with the experimental measurements obtained using a shadow moiré system. The effects of the heat sink and loading distance on the solder joint reliability performance are then examined. It is shown that the addition of the heat sink and a longer loading distance increase the solder ball creep strain energy density (CSED) and degrade the package reliability performance accordingly.

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Section: Introductionmentioning

confidence: 99%