Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Ko, Yong-Ho; Son, Kirak; Kim, Gahui; Park, Young-Bae; Yu, Dong-Yurl; Bang, Junghwan; Kim, Taek‐Soo

doi:10.1007/s10854-018-0506-y

Cited by 7 publications

(2 citation statements)

References 36 publications

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“…With the growing demand for smaller size and higher integration of microelectronics in electronic packaging, the size of solder joints in copper pillar bump has been gradually decreased (Ko et al, 2019). This means that higher current densities and temperature may occur in the solder joints, giving rise to EM.…”

Section: Introductionmentioning

confidence: 99%

Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints

Yang¹,

Huang²

2023

Front. Mater.

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Electromigration is the massive metal atom transport due to electron flow, which could induce a disconnect in electronics. Due to the size of copper pillar bump reduction, the portion of interfacial intermetallic compound in solder joints is increasing obviously. However, there is lack of systematical research on the effects of intermetallic compound on the EM lifetime of solder joints. In this paper, the interfacial intermetallic compound of copper pillar joints is modified to extend the electromigration lifetime. The growth rate of intermetallic compound in solder joints sample is calculated firstly. From 230°C to 250°C, the growth rate of intermetallic compound increases from 0.09 μm/min to 0.19 μm/min. With a longer reaction time, the intermetallic compound layers continuously grow. Then electromigration tests were conducted under thermo-electric coupling loading of 100°C and 1.0 × 104 A/cm2. Compared with lifetime of thin and thick intermetallic compound samples, the lifetime of all intermetallic compound sample improved significantly. The lifetime of thin, thick, and all intermetallic compound samples is 400 min, 300 min, and 1,200 min, respectively. The failure mechanism for the thin intermetallic compound sample is massive voids generation and aggregation at the interface between solder joints and pads. For the thick intermetallic compound sample, the intermetallic compound distance is short between cathode and anode in solder joints, leading to lots of crack create in the middle of solder joints. As the all intermetallic compound sample can greatly reduce the number of voids generated by crystal structure transforming, the lifetime extend obviously.

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Section: Introductionmentioning

confidence: 99%

Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints

Yang¹,

Huang²

2023

Front. Mater.

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“…Thermostatic electromigration refers to the mass transfer behavior of lead−free solder joints at a constant temperature driven by the “electron wind” generated by a high current density and controlled by diffusion [ 14 , 15 , 16 , 17 , 18 ]. Its prominent characteristics are the asymmetric growth of the IMC and the asymmetric dissolution of the metal matrix, which leads to the appearance of Kirkendall voids.…”

Section: Introductionmentioning

confidence: 99%

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Zhang

Gao

et al. 2023

Materials

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To solve the electromigration problem of micro−electronic connection solder joints, an ideal electromigration tester was designed, and the thickness of the intermetallic compounds (IMCs), average void diameter, grain orientation, failure, shear strength, and fracture path of Sn2.5Ag0.7Cu0.1RE0.05Ni−GNSs/Cu solder joints under constant−temperature electromigration were studied. The results indicate that the solder joints show evidence of typical electromigration polarity in the asymmetric growth of interfacial IMCs on the anode and cathode sides under the conditions of a current density ≥7 × 103 A/cm2 and an included angle between the c−axis of the β−Sn grains and the current direction θ ≤ 53.2°. The anode−side interfacial IMC is dominated by a Cu6Sn5 phase with a gradually increasing thickness, forming a Cu3Sn phase and showing evidence of microcracks. The Cu6Sn5 phase of the cathode−side interfacial IMC is gradually completely dissolved, and the growth of the Cu3Sn phase is accompanied by the formation of Kirkendall voids. The anisotropic diffusion of Cu atoms in the β−Sn of the micro−solder joints causes increased solder joint resistance and reduced shear strength. The shear fracture path of the solder joints moves from the cathode side near the IMC solder seam to the Cu3Sn interface. The shear fracture mechanism changes from ductile transgranular fracture dominated by β−Sn dimples to brittle fracture dominated by interfacial IMC cleavage and slip steps.

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Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints

Liu

et al. 2021

Journal of Elec Materi

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Effects of graphene oxide on the electromigration lifetime of lead-free solder joints

Cited by 7 publications

References 36 publications

Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints

Interfacial intermetallic compound modification to extend the electromigration lifetime of copper pillar joints

Study on Microstructure and Mechanical Properties at Constant Electromigration Temperature of Sn2.5Ag0.7Cu0.1RE0.05Ni-GNSs/Cu Solder Joints

Effects of Trace Elements Ag, Bi and Ni on Solid–Liquid Electromigration Interface Diffusion in Solder Joints

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