Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints

Xu, Longhua; Wang, Lixia; Jing, Hongyang; Liu, Xiangdong; Wei, Jun

doi:10.1016/j.jallcom.2015.08.018

Cited by 53 publications

(8 citation statements)

References 24 publications

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“…Kumar et al (2008) concluded that adding single-walled carbon nanotubes (SWCNT) into SAC played a significant role in reducing the average size of the IMCs due to the dispersion of nanotubes at the grain boundaries of the Ag 3 Sn, which resulted in a uniform morphology. Xu et al (2015) studied the impact of graphene-nano-sheets (GNSs) on SAC. Their study found that GNSs participated in restricting grain growth and gave fine IMCs.…”

Section: Microstructurementioning

confidence: 99%

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Aamir

Muhammad

Tolouei‐Rad

et al. 2019

SSMT

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Purpose The research on lead-free solder alloys has increased in past decades due to awareness of the environmental impact of lead contents in soldering alloys. This has led to the introduction and development of different grades of lead-free solder alloys in the global market. Tin-silver-copper is a lead-free alloy which has been acknowledged by different consortia as a good alternative to conventional tin-lead alloy. The purpose of this paper is to provide comprehensive knowledge about the tin-silver-copper series. Design/methodology/approach The approach of this study reviews the microstructure and some other properties of tin-silver-copper series after the addition of indium, titanium, iron, zinc, zirconium, bismuth, nickel, antimony, gallium, aluminium, cerium, lanthanum, yttrium, erbium, praseodymium, neodymium, ytterbium, nanoparticles of nickel, cobalt, silicon carbide, aluminium oxide, zinc oxide, titanium dioxide, cerium oxide, zirconium oxide and titanium diboride, as well as carbon nanotubes, nickel-coated carbon nanotubes, single-walled carbon nanotubes and graphene-nano-sheets. Findings The current paper presents a comprehensive review of the tin-silver-copper solder series with possible solutions for improving their microstructure, melting point, mechanical properties and wettability through the addition of different elements/nanoparticles and other materials. Originality/value This paper summarises the useful findings of the tin-silver-copper series comprehensively. This information will assist in future work for the design and development of novel lead-free solder alloys.

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Section: Microstructurementioning

confidence: 99%

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Aamir

Muhammad

Tolouei‐Rad

et al. 2019

SSMT

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“…15 Non-metal reinforcement doping is another method for improving the performance of lead-free solders. [17][18][19][20] For example, Xu et al 17 reported the addition of graphene nanosheets can effectively suppress the growth of intermetallic compounds (IMCs) at the interface between Sn-Ag-Cu solder and Cu substrates.…”

Section: Introductionmentioning

confidence: 99%

Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging

Nishikawa

Hirata

Yang

et al. 2022

JOM

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Sn-58Bi, an eutectic alloy, has been explored for use as a low-temperature lead-free solder alloy. However, the properties of Sn-Bi alloys as well as those of their joints need to be improved significantly so that these alloys can be applicable for practical use. In particular, two drawbacks need to be addressed: the intrinsic brittleness of Bi and the microstructure coarsening of these alloys during aging. In this study, Sn-Bi-Zn (SBZ) and SBZ-In (SBZI) alloys with low Bi contents were examined to elucidate the effects of the addition of Zn and In to the Sn-45Bi alloy on the interface and shear strengths of Cu/Cu joints before and after aging. In the case of the SBZ/Cu and SBZI/Cu joints, Bi coarsening was not observed either near or at the interfaces of the Cu/Cu joints. The shear strengths of the SBZ and SBZI joints remained unchanged after aging for 1008 h, suggesting that the SBZI alloy demonstrated the highest long-term reliability among all the joints examined.

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“…Hence, a number of lead-free solders have been developed as the candidate solders [2][3][4] . Meanwhile, many lead-free solder alloys, mainly consist of Sn matrix and small additions of other elements, including Sn-Zn [5] , Sn-Sb [6] , Sn-Cu [7] and Sn-Ag alloys [8][9][10] , have received more attention. In fact, full implementation of new Pb-free solders implies a detailed knowledge and understanding of their thermodynamics, wettability, microstructure, and so on.…”

Section: Introductionmentioning

confidence: 99%

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

Qu¹,

Cui²,

Liu³

et al. 2018

Proceedings of the 4th Annual International Conference on Material Engineering and Application (ICMEA 2017)

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Abstract-To simulate the application environment of a number of electronic products, the growth of Sn-0.3Ag-0.7Cu-0.5Bi-Ni/Cu solder joints with low content of Ag was investigated during aging in an interval mode. It shows that the intermetallic compound (IMC) (Cu,Ni) 6 Sn 5 layer becomes thicker with increasing aging time. The growth of IMC (Cu,Ni) 6 Sn 5 layer during aging follows the diffusion control mechanism. Furthermore, it is demonstrated that there is no IMC Cu3Sn layer appear whatever increasing the aging time. It is explained the phenomenon is mainly attribute to the interval aging mode. According to kinetics, the activation energy is not high enough to overcome the energy obstacle due to the interval aging mode and finally the Cu3Sn phase doesn't form. Hence, the reliability of solder joints is improved.

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Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints

Cited by 53 publications

References 24 publications

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics

Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging

Effect of Interval Aging Mode on IMC Growth between Low Ag Content Sn-0.3Ag-0.7Cu-0.5Bi-Ni and Cu Substrate

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