Abstract:Design against adhesion in microelectromechanical devices is predicated on the ability to quantify this phenomenon in microsystems. Previous research related the work of adhesion for an adhered microbeam to the beam's unadhered length, and as such, interferometric techniques were developed to measure that length. We propose a new vibration-based technique that can be easily implemented with existing atomic force microscopy tools or similar metrology systems. To make such a technique feasible, we analysed a mod… Show more
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