“…Various resistors are available in standard CMOS technology, including poly, diffusion, and metal resistors, each governed by distinct aging mechanisms. The primary factor responsible for the shift in poly resistance is the depassivation of hydrogen at grain boundaries, coupled with hydrogen migration within an electric field [26], [27], [28], [29], [30], [31]. On the other hand, the alteration in metal resistance predominantly stems from electromigration (EM), a phenomenon that propels the migration of metal atoms and consequently leads to the formation of voids within the resistor's structure [31], [32], [33].…”