2002
DOI: 10.1006/spmi.2002.1048
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Effects of electrical and temperature stress on polysilicon resistors for CMOS technology applications

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Cited by 10 publications
(7 citation statements)
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“…Various resistors are available in standard CMOS technology, including poly, diffusion, and metal resistors, each governed by distinct aging mechanisms. The primary factor responsible for the shift in poly resistance is the depassivation of hydrogen at grain boundaries, coupled with hydrogen migration within an electric field [26], [27], [28], [29], [30], [31]. On the other hand, the alteration in metal resistance predominantly stems from electromigration (EM), a phenomenon that propels the migration of metal atoms and consequently leads to the formation of voids within the resistor's structure [31], [32], [33].…”
Section: A Techniques For Long-term Stability Improvementmentioning
confidence: 99%
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“…Various resistors are available in standard CMOS technology, including poly, diffusion, and metal resistors, each governed by distinct aging mechanisms. The primary factor responsible for the shift in poly resistance is the depassivation of hydrogen at grain boundaries, coupled with hydrogen migration within an electric field [26], [27], [28], [29], [30], [31]. On the other hand, the alteration in metal resistance predominantly stems from electromigration (EM), a phenomenon that propels the migration of metal atoms and consequently leads to the formation of voids within the resistor's structure [31], [32], [33].…”
Section: A Techniques For Long-term Stability Improvementmentioning
confidence: 99%
“…where A is an empirically determined constant, J is current density (A/cm 2 ), n is the empirically determined current density factor, E a is the activation energy (eV), k is Boltzmann's constant, and T is the absolute junction temperature of the resistor during the aging stress. The TTF estimation can be achieved through Black's approach, as demonstrated by (1) [29], [31], [32], [33], or by employing an alternate model, as depicted in (2) [26], [29], [31] to accommodate low current density (J ) scenarios. E a represents a vital aging-associated parameter obtained by fitting aging experimental data with (1) or (2).…”
Section: A Techniques For Long-term Stability Improvementmentioning
confidence: 99%
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“…4) For example, in regulator circuits, the stability and reliability of resistors directly affect the accuracy of voltage supplied to the electrical circuit. 5,6) A poly-Si thin film is the most ideal choice for embedded resistors in CMOS integrated circuit because of its low and stable voltage and temperature coefficients. 7) Many factors influence the electrical properties of the poly-Si resistors during the deposition process, such as process temperature, dopant concentrations, and the overall thermal budget.…”
Section: Introductionmentioning
confidence: 99%