Effects of diffusion induced recrystallization on volume diffusion in the copper-nickel system

Schwarz, Stephen; Kempshall, Brian W.; Giannuzzi, Lucille A.

doi:10.1016/s1359-6454(03)00082-x

Cited by 59 publications

(28 citation statements)

References 20 publications

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“…There is a very good agreement between the present results and those of Kaja 16 range of 20-80 at % Ni. In contrast, the more recent results of Schwarz et al 17 are as much as about an order of magnitude higher than those of Kaja and the present study. In comparing their results to those of Kaja, Schwarz et al attributed the higher values they calculated to grain size effect.…”

Section: ͑4͒contrasting

confidence: 88%

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Directional electromigration-enhanced interdiffususion in the Cu–Ni system

Zhao

Garay

Anselmi‐Tamburini

et al. 2007

Journal of Applied Physics

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The effect of a dc on the interdiffusivity D in the Cu-Ni system was investigated over the temperature range of 650-850°C and at current densities in the range of 0 -1000 A cm −2 . Interdiffusivities were calculated using the Sauer-Freise-den Broeder method and the values calculated in the absence of a current were in agreement with previously published results. The influence of the current on D depended on its direction relative to the two interfaces in the trilayered Cu-Ni-Cu samples. When the electronic flow was from Ni to Cu ͑cocurrent interface͒, the interdiffusivity showed a marked increase relative to copper content but was unchanged when the electronic flow was from Cu to Ni ͑countercurrent interface͒. The increase of D in the cocurrent interface depended on concentration and temperature. At lower temperatures, the increase becomes significant at higher copper concentrations but for the same value of current density, the increase is apparent at lower concentrations. The effective activation energy of interdiffusivity depended on concentration and decreased with the application of a current. The decrease was largest for higher copper concentrations. The results are interpreted in terms of a proposed vacancy-atom interaction for copper with the implication that the electron wind effect on Cu is counteracted by the effect of vacancies.

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Section: ͑4͒contrasting

confidence: 88%

“…[16][17][18][19] In Fig. 7͑a͒, we compare our results, calculated from the nickel concentration profiles, with those of Kaja 16 and Schwarz et al 17 at a common temperature of investigation, 650°C. There is a very good agreement between the present results and those of Kaja 16 range of 20-80 at % Ni.…”

Section: ͑4͒mentioning

confidence: 99%

Directional electromigration-enhanced interdiffususion in the Cu–Ni system

Zhao

Garay

Anselmi‐Tamburini

et al. 2007

Journal of Applied Physics

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“…The work of Fisher and Rudman [18] indicates that in solid-state sintering of Cu-Ni powder mixtures, grain boundary diffusion was a dominating diffusion mechanism. Therefore, an apparent diffusivity, D app , which includes the contributions of lattice and grain boundary diffusion, [9,17,[21][22][23] was used as follows:…”

Section: Comparison Of Model With Experimental Resultsmentioning

confidence: 99%

Modelling the influences of solid-state interdiffusion and dissolution on transient liquid phase sintering kinetics in a binary isomorphous system

Turriff

Corbin

2006

Metall Mater Trans A

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A simple model was developed to predict the impact that solid-state interdiffusion and dissolution have on liquid formation and its duration during transient liquid phase sintering (TLPS). The model predicts that solid-state interdiffusion can dramatically reduce the amount of liquid initially formed during heating. This reduction is dependent on the heating rate and initial base metal particle size. In cases of sintering above the additive phase melting point, the model predicts that base metal dissolution increases liquid phase formation and that this additional melting reduces the base metal particle size. The model predicts that longer times are required to solidify isothermally the greater amounts of liquid formed at higher temperatures (because of dissolution). This agreed qualitatively with experimental results for a Ni-65 wt pct Cu TLPS mixture sintered at 1090°C and 1140°C. Quantitative comparisons between the model and experiment were good at 1140°C; however, the rate of isothermal solidification was underestimated by the model for intermediate sintering times at 1085°C.

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“…Enhanced homogenization effect brought about by dynamic recrystallization or slower strain rate deformation may be attributed to these incessantly moving lattice defects included in dynamically recrystallized microstructure, which may accelerate diffusion of segregated elements similarly to pipe diffusion in dislocation core. [26][27][28][29][30] For validation of qualitative explanation for this phenomenon described above, it is expected that dynamic measurement of diffusion coefficient of solute elements under hot deformation is performed in a future study.…”

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confidence: 99%

Effects of Dynamic Recrystallization on .GAMMA. Grain Refinement and Improvement of Micro Segregation of As Cast Austenite in 9% Ni Steel

et al. 2005

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Effects of dynamic recrystallization on g grain refinement and improvement in micro segregation of elements such as Ni and Mn of as cast austenite in 9 % Ni steel were investigated by two kinds of experimental methods. The first one was a hot compression test using the specimens prepared from the strand cast slab and the hot rolled plate of 9 % Ni steel, and the other was a hot tensile straining test in the austenitic region after levitation melting and solidification. In the hot compression test, variations in onset strain and flow stress of steady state flow of dynamic recrystallization with hot deformation conditions were investigated. The onset strain was found to decrease below 0.25 at the temperatures above 1 523 K and the strain rate below 1ϫ10 Ϫ2 s Ϫ1. The activation energy value obtained from steady state flow stress was 421 kJ/mol. Dynamically recrystallized g grain size in as cast austenite of this steel was controlled simply by Z value with no dependence on the initial g grain size. This beneficial feature of dynamic recrystallization was confirmed by the experiment of tensile straining in austenite formed after levitation melting and solidification, where extremely coarse initial g grain size of around 1.9 mm was markedly refined down to 140 mm by straining such a small strain as 0.40. Micro segregation ratio of Ni and Mn in the strand cast 9 % Ni steel examined by EPMA analysis was 1.20 and 1.36, respectively. These values were found to decrease continuously with reduction in strain rate in hot deformation of austenite. That is, dynamic recrystallization in austenite taken place at lower strain rate deformation is much more effective for homogenization of segregated elements compared with high strain rate deformation.

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Effects of diffusion induced recrystallization on volume diffusion in the copper-nickel system

Cited by 59 publications

References 20 publications

Directional electromigration-enhanced interdiffususion in the Cu–Ni system

Directional electromigration-enhanced interdiffususion in the Cu–Ni system

Modelling the influences of solid-state interdiffusion and dissolution on transient liquid phase sintering kinetics in a binary isomorphous system

Effects of Dynamic Recrystallization on .GAMMA. Grain Refinement and Improvement of Micro Segregation of As Cast Austenite in 9% Ni Steel

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