Effects of different sizes and cutting-edge heights of randomly distributed tetrahedral abrasive grains on 3C–SiC nano grinding

Zhao, Xiuting; Wang, Ziyue; Zheng, Chuntao; Yue, Chong

doi:10.1016/j.mssp.2024.108150

Materials Science in Semiconductor Processing

2024

DOI: 10.1016/j.mssp.2024.108150

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Effects of different sizes and cutting-edge heights of randomly distributed tetrahedral abrasive grains on 3C–SiC nano grinding

Xiuting Zhao,

Ziyue Wang,

Chuntao Zheng

et al.

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Effects of different sizes and cutting-edge heights of randomly distributed tetrahedral abrasive grains on 3C–SiC nano grinding

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References 24 publications

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