2020
DOI: 10.1016/j.precisioneng.2019.12.005
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Effects of deep subsurface damages on surface nanostructure formation in laser recovery of grinded single-crystal silicon wafers

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Cited by 15 publications
(4 citation statements)
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“…The Raman peaks of the unpolished and polished surfaces were 480 cm −1 and 477 cm −1 , respectively. Generally, the Raman peak shift indicates residual stress [ 18 ], and full width at half maximum (FWHM) indicates the crystallinity of a material [ 25 ]. On the polished surface, the amorphous silicon peak shifted to 477 cm −1 , indicating that the residual stress layer was removed by the polishing process.…”
Section: Resultsmentioning
confidence: 99%
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“…The Raman peaks of the unpolished and polished surfaces were 480 cm −1 and 477 cm −1 , respectively. Generally, the Raman peak shift indicates residual stress [ 18 ], and full width at half maximum (FWHM) indicates the crystallinity of a material [ 25 ]. On the polished surface, the amorphous silicon peak shifted to 477 cm −1 , indicating that the residual stress layer was removed by the polishing process.…”
Section: Resultsmentioning
confidence: 99%
“…The solid–liquid interface was protuberated in the center region owing to fluctuations created by continuous pulse shocks. The isotherms were partially compressed by the interface with a larger temperature gradient, generating a compressive force F a , which promoted the growth of micro-protrusions [ 18 ]. Owing to the temperature profile characteristics at the solid–liquid interface, the protrusions grew with the solid–liquid interface fluctuations under compression force F a , as shown schematically in Figure 12 b.…”
Section: Resultsmentioning
confidence: 99%
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“…Silicon carbide, gallium nitride, and aluminum nitride with excellent properties are considered as the third-generation semiconductor materials which will be the future of the semiconductor industry (Burk et al, 1999), but silicon-based materials, such as single-crystal silicon, still dominate the current semiconductor industry for the foreseeable years such that it is needed in continuously developing the advanced manufacturing technologies for these silicon-based materials (Niitsu and Yan, 2020;Bu et al, 2022).…”
Section: Introductionmentioning
confidence: 99%