Effects of Cu, Cu₃Sn, Cu₆Sn₅ on Interfacial Properties between Cu–Sn Alloys and Diamond

Abstract

The interfacial properties of the Cu‐based intermetallic compounds and diamond abrasives remain a challenging task in fabricating high‐performance Cu‐based diamond‐grinding wheels and, herein, the effects of Cu, Cu3Sn, and Cu6Sn5 on interfacial properties between Cu–Sn alloys and diamond (111) are aimed to be investigated. The stable three‐layer slab models are established based on density‐functional theory (DFT). The interface energy, electronic density, electronic localization function (ELF), and density of state (DOS) are calculated and analyzed. It is shown that Cu6Sn5 is a critical intermetallic compound to affect interfacial properties. The degree of hybridization of the Cu6Sn5 (100)/diamond (111) model is the strongest among all models, which leads to lower interface energy and better wettability. Herein, theoretical guidance for fabricating Cu‐based diamond‐grinding wheels by adjusting the sintering temperature and formula of the Cu‐based binder to achieve the proper interface strength are provided.

Modulation Mechanism of Transition Elements Fe and Mn on the Interface Bonding Performance of Bronze/Diamond Composites

“…[ 17 ] In the context of bronze‐based diamond‐grinding wheels, the bonding behavior at the interface between the bronze matrix material and diamond‐abrasive significantly influences two critical aspects: the service life (stable grinding time) and self‐sharpening performance. [ 18 ] Enhanced wettability of the matrix material to the diamond‐abrasive grains leads to stronger adhesion, prolonging stable grinding time. Simultaneously, maintaining self‐sharpening during the grinding process is essential for achieving desired surface quality.…”