Effects of Crack Surface Conductance on Intensity Factors for a Functionally Graded Piezoelectric Material under Thermal Load

Ueda, Sei; Nishimura, Naoki; Kondo, Hironori

doi:10.1299/kikaia.72.2066

Cited by 7 publications

(1 citation statement)

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“…During design, the requirements of structural strength, reliability and lifetime of piezoelectric structures/components call for enhanced mechanical performance, including stress and deformation distribution under multifield loading. Ueda studied the fracture of an FGPM strip with a normal crack [3,4], of a symmetrical FGPM strip with a center crack [5] due to a thermal load, mixed-mode thermoelectromechanical fracture problems for an FGPM strip with a two-dimensional crack [6,7], and a penny-shaped crack [8,9]. Consequently, a new kind of material, FGPM, has been developed to improve the reliability of piezoelectric structures by extending the concept of the well-known FGM to piezoelectric materials [1].…”

Section: Introductionmentioning

confidence: 99%

Solution Methods for Functionally Graded Piezoelectric Materials

Qin

2013

Advanced Mechanics of Piezoelectricity

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In the previous two chapters Saint-Venant decay and penny-shaped crack problems were discussed. The material properties of the piezoelectric materials considered there were homogeneous or piecewise homogeneous. This chapter presents solution methods for piezoelectric materials with continuously varying properties. It focuses on problems of an angularly graded piezoelectric wedge, solutions for FGPM beams, problems of parallel cracks in an FGPM strip, and mode cracks in a two-bonded FGPM.

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Section: Introductionmentioning

confidence: 99%

Solution Methods for Functionally Graded Piezoelectric Materials

Qin

2013

Advanced Mechanics of Piezoelectricity

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Transient Thermoelectroelastic Response of a Functionally Graded Piezoelectric Strip with an Annular Crack

Ueda

Nishimura²

2009

Trans.JSME, Ser.A

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Transient responsc of an annular crack in a plate of a functionallygraded piezDelectric m 烈 teria1 ( FGPM )is studied under thermal shock load ［ ng collditiolls ． It is assumed that the t［ herm 〔〕electroelas ・ tic pr 〔〕 perties of the strip vary continuousIy along the thickness Dfthc strip ， and that the crack faces are completely insulated ． SDme material propcrties are assunled to be exponentially dependent on the distance fromthc crack line paralel † o the boundaries of the plate ． By using b ｛｝th the Lapluce and Hankel trallsforms ， the thermal ancl electrome ⊂hallical problems are reduced to a singular integral equa 亡 i〔，n and a system of singular ｛ ntegral equations ． The singular integrul equatiens are solved numerically ， and a numerical method is then enlployed to obtain 出 e 亡 ime dependent solutio 】 rsby way of a Laplace inversiun technique ． The intensity factors versus time are presented for various values of dimensionless paralneters representing the lnaterial nonhoinegeneit ) ・ and the crack positior ／．

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