“…Fillers with high thermal conductivity used for thermoplastic composites, e.g., multi-wall carbon nanotubes (MWCNTs), carbon fibers, and coppers, could effectively improve the thermal conductivity of polymer composites [9,10,11,12]. While fillers with high electrical resistance such as boron nitride (BN) and aluminium nitride (AlN) have been already introduced to polymers [13,14], electrical isolation is one of the necessary properties of packaging material for those with high thermal conductivity such as electronic devices.…”