Effects of Configuration on Plastic Package Stresses

Nguyen, Luu; Gee, S.A.; Bogert, W.F. van den

doi:10.1115/1.2905426

Cited by 34 publications

(7 citation statements)

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“…Test chips with integrated microsensors for plastic package analysis were reported in considerable detail [11,25]. Such microsensors measure thermal stress [26,27], corrosion [28][29][30][31], and moisture [25,31].…”

Section: Packaging Characterization By Microsensorsmentioning

confidence: 99%

“…Off-line evaluations of stress and temperature fields within the package are useful for the assessment of package materials and geometries [11]. For this purpose, various acoustic and electromagnetic waves are used to nondestructively screen the product.…”

Section: Microelectronic Package Evaluationmentioning

confidence: 99%

“…On these chips, p-n junctions [32] and aluminum resistors [30,41] serve as temperature sensors, while piezoresistors are used as stress detectors [11,[35][36][37]. Piezoresistive sensors were used to investigate thermal stress on the chip [11]. They were also used to determine chip stresses after molding, post-224 inspection using X-ray cure, and thermocycles, respectively [37].…”

Section: Packaging Characterization By Microsensorsmentioning

confidence: 99%

“…Various test chips are commercially avail-able [38][39][40]. On these chips, p-n junctions [32] and aluminum resistors [30,41] serve as temperature sensors, while piezoresistors are used as stress detectors [11,[35][36][37]. Piezoresistive sensors were used to investigate thermal stress on the chip [11].…”

Section: Packaging Characterization By Microsensorsmentioning

confidence: 99%

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Microelectronic Bonding Processes Monitored by Integrated Sensors

Mayer¹,

Schwizer

2002

Sensors Update

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Real-time monitoring methods are beneficial for the control, optimization, and failure analysis of microelectronic packaging processes. The focus of this chapter is on the real-time monitoring of two widely used processes, soft solder die bonding and thermosonic ball bonding. The methods presented here use uniquely developed microsensors integrated on custom-made test chips using commercial double-metal CMOS processes.For the soft solder die bonding process, nine aluminum-based resistive temperature detectors were integrated on various locations on a test chip. The temperature was monitored during the placement of the test chip on the leadframe. The experimental results describe the wetting and spreading effects of the molten solder under the drip. Together with numerical results obtained with a transient thermal finite element model, the beginning of wetting can be quantified. For the soft solder PbSn10, wetting occurred around 30 ms after touch down. This method hence can be used to determine wetting times under different process conditions. The wetting time determines an upper limit of the throughput of the process.For the thermosonic ball bonding process, temperature and force sensors were integrated on test chips. The sensors are aluminum resistors and piezoresistive p + -and n + -diffused resistors placed around bond pads. A bond quality parameter can be derived from the temperature signal variation during bonding. The piezoresistive sensors permit the measurement of forces in the x-, y-, and z-directions simultaneously. The ultrasonic tangential force signal reached a typical value of 0.12 N on a 50 lm diameter contact zone and revealed significant process characteristics. Four process phases are identified which are necessary for a successful ball bond formation. These phases are assigned to initial stiction, sliding, bond growth, and deformation effects.

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Section: Packaging Characterization By Microsensorsmentioning

confidence: 99%

Section: Microelectronic Package Evaluationmentioning

confidence: 99%

Section: Packaging Characterization By Microsensorsmentioning

confidence: 99%

Section: Packaging Characterization By Microsensorsmentioning

confidence: 99%

See 2 more Smart Citations

Microelectronic Bonding Processes Monitored by Integrated Sensors

Mayer¹,

Schwizer

2002

Sensors Update

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“…For example, memory devices have high aspect ratios (rectangular) compared to the square ASIC counterparts. This apparently minor shape variation does create quite a differing internal stress profile, which may affect sensitive structures on the dies (11).…”

Section: Reoulrementsmentioning

confidence: 99%

Molding Compound Trends In A Denser Packaging World. I. Technology Evolution

Nguyen¹,

Lo²,

Belimi³

Proceedings of Japan International Electronic Manufacturing Technology Symposium

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Epoxy molding compounds have mlwd o~r the years to meet the stringent requirements of encapsulating ever w e complex circuitry, larger die sizes, and shrinking features.Traditionally, compound development targets the m m y market first, since the latter incorporates the latest technological advances. As a result, the functional requirements of the compounds are tailored to provide the optimal properties for the form factors of these memory packages. Subsequently, these compounds are introduced to the other product classes such as logtc, analog, and ASIC, and further modified to fulfill any potentially new specific requirement. However, as the configurations become more standardized, the functional specifications of molding compounds rewedfor packaging m y ICs merged with those of the other package fm fnctors. Thus, current mold compound developmental efforts aim at optimizing the compound properties for a gim family of packages such as PQFP or TSOP, rather than a @pen class ofdetcica.This paper discusses the evolution of the mold compound technology, from the generation of standard nmolac-based epoxies to the third generation of ultra-low stress, siZicune-modij?ed, highly-filled compounds. Although each generation has difm'ng compmndingfirmulations, each can be charactenzed by an "effective stress index", which normalizes both modulus and coefficient of thermal expansion with the package fonnjictor into a generic expression that MI be used for benchmarking. The interaction of these material developments with a d m c e s in IC technology, such as reduced die dimensions, shrinking feature sizes, and ever expanding packaging options, is also addressed. The arrent typical mold compound must satisfy functional requirements ofmoldabi2ity, low stress, crack resistance, and high thermal wnductivity. 1.This is the first in a series of papers exploring the technology issues involved with molding compounds used for electronic packaging. Development trends, reliability concerns, material interactions, and optimization of properties for the best package performance will be addressed in the series.This issue examines the trends of compound development, which initially mirrored advances in the memory market, but more recently, attempted to satisfy the functional requirements of classes of packages rather 0-7803-14328/93 $3.00 831953 IEEE I 204 than categories of IC devices. For instance, paper-thin packages present different assembly and reliability challenges than the voluminous standard DIPS, SOS, or PLCCs. Whether memory, analog, or logic ICs are inserted into the packages is no longer the driving force in molding technology. As a result, all the compound requirements of moldability, curing stresses, adhesion, moisture absorption, anti-popcorn toughness, and thermal stability undergo continuous revision. Remarkably, although different epoxy formulations are offered to meet various specific needs, the compounds must all meet the same end hurdle -to pass or surpass the battery of qualification and accelerated reliability tests...

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Plastic Packaging

Pecht¹,

Nguyen²

1997

Microelectronics Packaging Handbook

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Effects of Configuration on Plastic Package Stresses

Cited by 34 publications

References 0 publications

Microelectronic Bonding Processes Monitored by Integrated Sensors

Microelectronic Bonding Processes Monitored by Integrated Sensors

Molding Compound Trends In A Denser Packaging World. I. Technology Evolution

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