Effects of compound coupling agents on the properties of PTFE/SiO2 microwave composites

Yuan, Ying; Yin, Yuting; Yu, Dingding; Lin, Hung‐I; Wang, Jie; Tang, Bin; Li, Enzhu

doi:10.1007/s10854-016-5929-8

Cited by 19 publications

(9 citation statements)

References 19 publications

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“…In this composite system, PTFE molecules don't have polarity due to its symmetric structure. Therefore, the polarization type of PTFE is only electronic displacement polarization so that PTFE shows a negative τ ε of −400 ppm/˚C [10]. On the contrary, SiO 2 ceramic and E-glass fibers present a positive τ ε resulted from its dominant ionic displacement polarization.…”

Section: Resultsmentioning

confidence: 97%

“…It is well known that copper conductor layer is laminated over PTFE substrate for circuit fabrication. Therefore, the CTE of composite is a key parameter for microwave substrate, which should be close to that of copper (CTE~17 ppm/˚C) [10]. As is well know, E-glass fiber has a CTE of approximately 4.8 ppm/˚C, which is far less than that of PTFE about 109 ppm/˚C.…”

Section: Introductionmentioning

confidence: 98%

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Effects of Content of Chopped Glass Fibers on the Properties of Silica Filled PTFE Composites

Yuan¹,

Lin²,

Jiang³

et al. 2017

MSCE

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In this work, the polytetrafluoroethylene (PTFE)-based composite substrates were manufactured by mixing, calendering, hot-pressing sintering. The composition of all the samples was PTFE, SiO 2 and chopped E-glass fibers. The effects of content of E-glass fibers on the properties of the SiO 2 filled PTFE composites were investigated, including density, water absorption, dielectric properties (ε r , tanδ), coefficient of thermal expansion (CTE) and temperature coefficient of dielectric constant (τ ε ). The compositions of inorganic materials mixture are (62 − x) % SiO 2 + x % E-glass fiber (x: mass ratio to composites, x = 0, 1, 1.5, 2, 2.5, 3). The results show that as the content of E-glass fibers is 2.5 wt.%, this composite obtains optimal properties, including excellent dielectric properties (ε r~2 .9123, tanδ~0.0011), acceptable water absorption of 0.075%, temperature coefficient of dielectric constant of 10 ppm/˚C and coefficient of thermal expansion of 15.87 ppm/˚C.

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Section: Resultsmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 98%

Effects of Content of Chopped Glass Fibers on the Properties of Silica Filled PTFE Composites

Yuan¹,

Lin²,

Jiang³

et al. 2017

MSCE

Self Cite

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“…Han et al [9] introduced hollow silica microspheres with porous surfaces into PTFE, which improved mechanical chimerism and signi cantly enhanced the composites' dielectric properties. The second is to treat the surface of inorganic ller with coupling agent [6,8,[10][11][12][13] to make PTFE (SP ~ 12.7) and inorganic ller have similar Solubility Parameter (SP), thereby increasing the wettability of PTFE on the surface of inorganic ller and improving the interfacial adhesion [14]. Yao et al [15] used F8261 coupling agent to treat ceramic and GF's surface, made the water absorption of the composite reach 0.12%, and the dielectric loss decreased by 0.0024.…”

Section: Introductionmentioning

confidence: 99%

Improved properties of PTFE composites filled with glass fiber modified by sol–gel method

Liu

Mahmood

et al. 2021

J Mater Sci: Mater Electron

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Tetraethyl orthosilicate (TEOS) was used as the silicon source, and polydimethylsiloxane (PDMS) was the organic precursor to modify the surface of glass ber (GF) through the sol-gel method. The modi ed GF noted T-GF was lled in PTFE to prepare PTFE/T-GF composites. SEM, FTIR, XPS, and contact angle con rmed that organic-inorganic hybrids were successfully loaded on GF's surface. Compared with PTFE/GF and the conventional coupling agent modi ed GF lled PTFE composites, the properties of PTFE/T-GF composites, including dielectric properties, mechanical properties, moisture absorption, thermal conductivity, and coe cient of thermal expansion (CTE), enhanced signi cantly for the improvement of compatibility of PTFE and GF. Moreover, the PTFE/T-GF exhibited improved dielectric constant (2.305), decreased dielectric loss (9.08E -4 ), higher bending strength (21.45 MPa) and bending modulus (522 MPa), better thermal conductivity (0.268 W/m*K) and lower CTE (70 ppm/℃), making it has promising application as the substrate materials for printed circuit board.

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“…In previous reports, the introduction of inorganic fillers into the resin matrix, such as BN [16][17][18], Si 3 N 4 [19], SiO 2 [20], Al 2 O 3 [21], AlN [22], and SiC [23], has become a common method to improve the performance of substrate materials. However, the presence of different functional groups on the surface of the filler results in a poor compatibility between the filler and the polymer.…”

Section: Introductionmentioning

confidence: 99%

Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Wang

Zhang³

et al. 2021

Polymers

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High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

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Effects of compound coupling agents on the properties of PTFE/SiO2 microwave composites

Cited by 19 publications

References 19 publications

Effects of Content of Chopped Glass Fibers on the Properties of Silica Filled PTFE Composites

Effects of Content of Chopped Glass Fibers on the Properties of Silica Filled PTFE Composites

Improved properties of PTFE composites filled with glass fiber modified by sol–gel method

Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

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