2013
DOI: 10.1039/c3ee41178h
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Effects of catalyst material and atomic layer deposited TiO2 oxide thickness on the water oxidation performance of metal–insulator–silicon anodes

Abstract: We report on the effects on water oxidation performance of varying (1) the nanoscale TiO 2 thickness and (2) the catalyst material in catalyst/TiO 2 /SiO 2 /Si anodes. Uniform films of atomic layer deposited TiO 2 are prepared in the thickness range $1-12 nm on degenerately-doped p + -Si, yielding water oxidation overpotentials at 1 mA cm À2 of 300 mV to 600 mV in aqueous solution (pH 0 to 14). Electron/hole transport through Schottky tunnel junction structures of varying TiO 2 thickness was studied using the … Show more

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Cited by 177 publications
(260 citation statements)
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“…However, based on previously reported values, 8 this thickness reduction will only improve overpotential by ~20 mV, which is significantly less than the observed improvements, so the majority of the improvement is due to the reduction in SiO2 thickness. The effect of forming gas temperature on TiO2-protected photoanode performance is a topic of ongoing study.…”
Section: III Oxide Thickness Reduction Through Titanium Oxygen Scavmentioning
confidence: 60%
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“…However, based on previously reported values, 8 this thickness reduction will only improve overpotential by ~20 mV, which is significantly less than the observed improvements, so the majority of the improvement is due to the reduction in SiO2 thickness. The effect of forming gas temperature on TiO2-protected photoanode performance is a topic of ongoing study.…”
Section: III Oxide Thickness Reduction Through Titanium Oxygen Scavmentioning
confidence: 60%
“…7 Previously reported research has shown that atomic layer deposited (ALD) TiO2 can effectively protect Si photoanodes, yielding efficient, stable devices. [7][8][9] Recently, we have investigated the tunnel barrier to hole transport presented by an interfacial layer (IL) of SiO2 in TiO2-protected Si photoanodes. 10 The SiO2 tunnel oxide can easily dominate the device resistance due to its large bandgap and relative lack of bulk oxide traps, compared to the TiO2 corrosion protection layer.…”
Section: Introductionmentioning
confidence: 99%
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“…al. (15). However, the characteristics of an interlayer formed during thermal preparation of Ru-or Ir oxide are not known.…”
Section: Introductionmentioning
confidence: 99%
“…1,2,[7][8][9][10][11][12][13] Incorporation of such protection layers into the MIS junction, however, has compromised the photovoltages commonly reported for these devices. An ideal MIS junction using silicon has a theoretical maximum open circuit voltage of 700-800 mV.…”
Section: Introduction: Metal-insulator-semiconductor (Mis) Structuresmentioning
confidence: 99%