Effects of Catalyst Deposition on Adhesion Between Electroless Ni-P Films and Polished Sapphire Substrate.

In the present study, the adhesive properties and initial deposition processes of electrolessdeposited Cu films to glass substrates in detail. The adhesive strengths of Cu thin films which were electrolessdeposited on the glass substrates were evaluated by adhesive tape test, while their surface structures were analyzed by using TEM. We used two step catalyzation (sensitization activation) method for pretreatment of electrolessdeposition onto glass substrates. The catalyst distribution can be made to vary. The adhesive strength of Cu films tends to increase with decreasing SnCl 2 concentration in sentitizer and increased with increasing surface roughness of glass substrates. In order to specify the exfoliation site, the quantitative analysis of Sn and Pd on the exfoliated film and the substrate was investigated by XPS. XPS analysis showed that Sn and Pd existed on the exfoliated films and only Sn existed on the substrates. The results indicated that the exfoliation of all the films electrolessdeposited on glass substrates occurred in the interface between the Sn adsorbates and the Pd adsorbates. The drying pretreatment after activation improved adhesive strength.

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The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate

Okamoto¹,

Kimura²,

Watanabe³

2005

J. Japan Inst. Metals

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Adsorbates Formed on Non-Conducting Substrates by Two-Step Catalyzation Pretreatment for Electroless Plating.

Yamagishi¹,

Yae²,

Okamoto³

et al. 2003

Journal of The Surface Finishing Society of Japan

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Aging Behavior of Sensitizer of Catalyzation Pretreatment for Electroless Plating

Okamoto¹,

Yae²,

Yamagishi³

et al. 2004

Journal of The Surface Finishing Society of Japan

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SnCl aqueous solution including HCl is used as a sensitizer of two-step catalyzation (sensitizationactivation) pretreatment for electroless metal plating onto non-conducting substrates. The sensitizer is inactivated by aging. In this study,the relationships among the Sn concentration of sensitizer,amount of adsorbates formed on the substrates, induction period of electroless Ni-P deposition and aging time have been investigated quantitatively. As the aging

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Effects of Catalyst Deposition on Adhesion Between Electroless Ni-P Films and Polished Sapphire Substrate.

Cited by 4 publications

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The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate

The Effect of Catalyst Density for Adhesion of Electroless Deposited Copper Films on Glass Substrate

Adsorbates Formed on Non-Conducting Substrates by Two-Step Catalyzation Pretreatment for Electroless Plating.

Aging Behavior of Sensitizer of Catalyzation Pretreatment for Electroless Plating

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