Abstract:The dependency of the failure mechanisms of PCB/BGA assemblies subjected to drop impact on board designs variations is investigated in this study. Two key parameters are considered: the copper pad size and the trace routing. It is shown that the assemblies can exhibit various failure modes such as copper trace crack, pad cratering on PCB or crack at interposer on package side by varying these board design parameters, due to stress/strain redistribution in assembly, as well as the location change of the weakest… Show more
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