Abstract:It has been observed that the step coverage achieved for aluminum deposition at 200~ on a multi-chamber (ultra-high vacuum) horizontal physical vapor deposition (PVD) system (System A) is electrically comparable to the step coverage on a single chamber, high vacuum (vertical) PVD system (System B) at 300~ under the optimized conditions ofpre-clean process, sputtering power, argon pressure and chamber hardware configuration. In addition, it has been determined that the metal step coverage is relatively poor at … Show more
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