Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy

Lee, Jae-Ean; Kim, Keun Soo; Inoue, Masahiro; Jiang, Junxiang; Suganuma, Katsuaki

doi:10.1016/j.jallcom.2006.12.037

Cited by 94 publications

(50 citation statements)

References 26 publications

(51 reference statements)

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“…Lee et al 11 reported superior strength for the Sn-9wt.%Zn-2wt.%Cu alloy, as compared to the present findings. In this case, the measured cooling rate during the production of the castings was 40 o C/s.…”

Section: Resultssupporting

confidence: 47%

“…It is very reasonable to expect that coarse Cu 5 Zn 8 primary intermetallics formed in the microstructure of the Cumodified alloy could result in decrease the strength. As previously stated by some authors 6,7,11 , the presence of Cu-Zn intermetallics depreciate the tensile strength and ductility of ternary Sn-Zn-Cu alloys.…”

Section: Resultsmentioning

confidence: 62%

“…The failure modes are the same for the three positions along the DS casting length as can be seen in the Figure 11. Das and co-authors 5 , Rahman et al 8 , Lee et al 11 and El-Daly and Hammad 7 described similar fracture mechanisms for ternary Sn-Zn-Cu alloys.…”

Section: Resultsmentioning

confidence: 80%

“…By examining the aforementioned findings concerning microstructure and mechanical properties in Sn-ZnCu [5][6][7][8]11 , correlations between the local length scales of the microstructure of the Sn-9Zn-Cu alloys, the formed IMCs and tensile properties are still undetermined in literature.…”

Section: Introductionmentioning

confidence: 99%

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Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Silva

Spinelli

2018

Mat. Res.

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The microstructure length-scales (dendritic and eutectic), morphologies and tensile properties of a ternary Sn-9wt.%Zn-2wt.%Cu alloy are compared with those of a binary eutectic Sn-9wt.%Zn alloy. The following experimental/analytical steps were performed: transient directional solidification experiments of the Sn-9wt.%Zn-2wt.%Cu alloy; measurements of secondary dendrite arm (λ 2 ) and interphase spacing (λ); morphology of the eutectic α-Zn phase; determination of thermal parameters such as cooling rate (Ṫ L ) and their evolutions during solidification; and, finally, interrelations of microstructure vs. tensile properties. The addition of 2wt.%Cu causes significant refinement of the eutectic structure. Hall-Petch type experimental expressions outlined the variations of strength and ductility with both λ 2 and λ. Very fine Zn globules and needles forming the eutectic in the ternary alloy seems to cause a reversal on ductility behavior, as compared to the tendency observed for the binary Sn-9wt.%Zn alloy. Here, for the ternary Sn-9wt.%Zn-2wt.%Cu alloy ductility increases with decreasing interphase spacing.

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Section: Resultssupporting

confidence: 47%

Section: Resultsmentioning

confidence: 62%

Section: Resultsmentioning

confidence: 80%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Silva

Spinelli

2018

Mat. Res.

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“…This finding is surprising, because only one peak was found during melting in all cases. However, double peaks are often presented in the literature 23,24 and are assigned to the noneutectic behavior of the studied Sn-based systems. Figures 3 and 4 show DSC results where the solder behaves as a eutectic alloy even when connected to a PCB with various surface finishes (Sn can be consumed or enters the liquid from the surface finish).…”

Section: Study Ofmentioning

confidence: 99%

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Rudajevová

Dusek

2014

Journal of Elec Materi

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Undercooling and recalescence were studied using the differential scanning calorimetry (DSC) method on real electronic systems. Two solder pastes, Sn 62.5 Pb 36.5 Ag 1 and Sn 96.5 Ag 3 Cu 0.5 , were used for preparation of electronic joints. Various combinations of these solders and soldering pads with different surface finishes such as Cu, Cu-Ni-Au, Cu-Sn, and Cu-Sn 99 Cu 1 were used. During melting of both pastes, the Sn and Sn 99 Cu 1 surface finishes immediately dissolved in the solder and the Cu surface coating was exposed to the melt. Therefore, practically the same undercooling was found for the Cu, Cu-Sn, and Cu-Sn 99 Cu 1 coatings. The lowest undercooling was found for the Cu-Ni-Au surface finish for both solder pastes. If two separated electronic joints were made on the sample, two separate peaks were found in the DSC signal during solidification. In the sample with only one joint, only one exothermic peak was found. These findings were observed for all paste/surface finish combinations. These data were analyzed, showing that this effect is a consequence of undercooling and recalescence: Latent heat released during solidification of the joint increases the surrounding temperature and influences all the processes taking place.

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Effect of minor Cu addition on corrosion behavior of Sn‐Zn‐xCu touch‐up solder alloys

Peng

Che

Kong

2017

Materials & Corrosion

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The corrosion behavior of Sn‐50Zn‐xCu (x = 0, 1, 2 wt%) touch‐up solder alloys was investigated by electrochemical techniques (potentiodynamic polarization, electrochemical impedance spectroscopy, and open circuit potential) and surface characterization (scanning electron microscopy, energy dispersive X‐ray spectrometry, and X‐ray diffraction), aiming to explore the effects of the Cu addition on the corrosion resistance. The results reveal that the dendritic‐like Zn‐rich phase of Sn‐50Zn was disadvantageous to form a protective corrosion product layer and offered convenient paths for the Cl− penetration into the substrate. However, the Cu addition to Sn‐50Zn based alloys led to the refinement of microstructure and the transformation of Zn‐rich phase's morphology which could result in the formation of more compact corrosion product layer. Thus, the corrosion resistance of Sn‐Zn‐Cu alloys was improved. The corrosion mechanism is also discussed.

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Effects of Ag and Cu addition on microstructural properties and oxidation resistance of Sn–Zn eutectic alloy

Cited by 94 publications

References 26 publications

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Correlations of microstructure and mechanical properties of the ternary Sn-9wt%Zn-2wt%Cu solder alloy

Study of Undercooling and Recalescence During Solidification of Sn62.5Pb36.5Ag1 and Sn96.5Ag3Cu0.5 Solders in Real Electronic Joints

Effect of minor Cu addition on corrosion behavior of Sn‐Zn‐xCu touch‐up solder alloys

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