2008
DOI: 10.1093/ietele/e91-c.7.1009
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Effects of a Thermal CVD SiN Passivation Film on AlGaN/GaN HEMTs

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“…3 with L g of 0.5 and W g of 320 m (80 m  4 fingers), respectively. The recessed ohmic structure, 19) the thermal CVD SiN passivation 20) and the field plate structure 21) were applied for RF performance improvement in these GaN-HEMTs.…”
mentioning
confidence: 99%
“…3 with L g of 0.5 and W g of 320 m (80 m  4 fingers), respectively. The recessed ohmic structure, 19) the thermal CVD SiN passivation 20) and the field plate structure 21) were applied for RF performance improvement in these GaN-HEMTs.…”
mentioning
confidence: 99%