Effectiveness of thermal redistribution layer in cooling of 3D ICs

Abstract

A cooling system composed of a thermal redistribution layer (TRDL) and a thermal through-silicon via (TTSV) is proposed for three-dimensional integrated circuits (3D ICs). According to the Fourier heat flow analysis theory, the heat flow model of the proposed cooling system is established and verified by finite element analysis (FEA). It is shown that the maximum error between the heat flow model and FEA is 2.98%, and the maximum temperature of 3D ICs can be reduced by 4.43 C. The established horizontal heat dissipation channel can effectively solve the heat dissipation problem in 3D ICs. K E Y W O R D Sredistribution layer (RDL), thermal management, three-dimensional integrated circuits (3D ICs), through-silicon via (TSV)

Shallow trench isolation structure design for through‐silicon vias stress reduction

“…TSV technology has been used to connect the layers of different functional modules vertically. It has the advantages of significantly reduced size, energy-saving and high-performance, 1 and can meet the increasing functional requirements, but it also faces serious thermomechanical reliability problems. [2][3][4] In the process of integrated circuits, due to the annealing process, [5][6][7] the chip will undergo a series of severe temperature changes.…”