Effective thermal conductivity of Cu/diamond composites containing connected particles

Abstract

An analytical model for the thermal conductivity of Cu/diamond composites with connected particles is presented by replacement of a cluster of connected particles with an equivalent polycrystal subsequently using a multiple effective medium approach. By applying this model to the measured thermal conductivity of Cu/diamond composites prepared by high pressure high temperature sintering technique reported in the literature, we show that it quite well describes the observed thermal conductivity enhancement induced by the connected particles. We estimate the value of connected particle loading in real composites and show that large particles are easier to form the bonding contact than small particles. The present work also demonstrates that the sensitivity of thermal conductivity contribution from the connected particles strongly depends on the particle size, and their pronounced thermal conductivity enhancement should lie within the certain particle size range.

Elastic behavior of disclination dipole near nanotube with surface/interface effect

“…This intimate contact can influence the properties of the matrix, and affect its chain entanglements, its morphology and even its crystallinity. In recent years there have been rapid advances in technology for synthesizing NTs made from various materials and modifying their surface chemical components, such as carbon and silicon carbide, [2][3][4][5] boron nitride (BN), [6][7][8] and titanium dioxide (TiO 2 ). [9,10] Therefore, NTs can be used as excellent nanofillers in diverse multifunctional composites to improve physical, mechanical, and electronic properties, and chemical capillarity, storage, and grafting properties of the composites unattainable from current materials.…”