2018 IEEE 68th Electronic Components and Technology Conference (ECTC) 2018
DOI: 10.1109/ectc.2018.00267
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Effective Stress Relief Without Jeopardizing Reliability in Overmolded Packages with Stress Buffers

A. Mavinkurve
1
,
J.J.M. Zaal2,
Yukai Liang3
et al.
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