Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy

Fawzy, A.; Fayek, S.A.; Sobhy, Mohammed; Nassr, E.; Mousa, Mohammad; Saad, Gamal R.

doi:10.1007/s10854-013-1230-2

Cited by 34 publications

(32 citation statements)

References 25 publications

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“…The melting temperatures of the plain and composite solders are 237.38 and 238.27 1C respectively. This result is agree with other previous reports on SAC composite solders [4,20,21]. The slight increase in melting point of the SSC-ZnO composite solder can be attributed to the effect of the nano-sized ZnO particles on the rate of solidification.…”

Section: Thermal Behaviorsupporting

confidence: 93%

See 1 more Smart Citation

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Fouda

Eid

2015

Materials Science and Engineering: A

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Section: Thermal Behaviorsupporting

confidence: 93%

“…Therefore, the incorporation of active surface ZnO nano-metric particles refines the size of IMCs. Similar behavior was reported by other groups [20,22]. The Curve of EDX analyses of a selected area in Fig.…”

Section: Metallographic Observationssupporting

confidence: 87%

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Fouda

Eid

2015

Materials Science and Engineering: A

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“…[7,8,[26][27][28][29] There are several studies on composite solders in the past with a variety of reinforcement materials, such as Al 2 O 3 , TiO 2 , ZrO 2 , Si 3 N 4 , SiC, SnO 2 , ZnO, CeO 2 , La 2 O 3 , to reinforce the solder matrix and improve the microstructural properties. [5,[10][11][12][13][30][31][32][33][34][35][36] However, limited studies exist in literature about the effect of ceramic nanoparticles on the evolution of Sn whisker growth after aging and its mitigation. It is also noticed that ZrSiO 4 has been rarely used to reinforce a solder matrix, which can be a potential candidate for designing a nanocomposite solder.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings

Bhattacharya

Sharma

Das

et al. 2016

Metall Mater Trans A

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The Sn-based ZrSiO 4 nanocomposite coatings have been synthesized by pulse co-electrodeposition technique from an aqueous electrolyte containing SnCl 2 AE2H 2 O, C 6 H 17 N 3 O 7 , Triton X, and varying amounts of nano-sized ZrSiO 4 particles (0,5,10,15,20,25,30, and 35 g/L). As-deposited films have been analyzed using X-ray diffraction, scanning electron microscope equipped with an energy dispersive X-ray spectrometer, and transmission electron microscope. The microhardness, wear as well as corrosion property of the coatings have been also evaluated. It is observed that the surface morphology of Sn-ZrSiO 4 nanocomposite coatings is strongly dependent on the reinforcement concentration in the electrolyte, and the Sn-ZrSiO 4 nanocomposite solder deposited from the electrolyte containing 25 g/L ZrSiO 4 yields the highest hardness and the best wear and corrosion property among all the synthesized samples. The whisker growth propensity of the developed Sn-ZrSiO 4 nanocomposites has also been examined after 90 days of aging at room temperature and reported here.

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“…Zinc oxide (ZnO) nanoparticles are used as dispersed phase in nanocomposite solders to improve the properties of the solders [25][26][27][28][29][30]. Speci cally, ZnO nanoparticles could improve the solder mechanical properties, including yield strength, tensile strength, and microhardness through microstructure re nement and dispersion strengthening [26][27][28].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, the shear strength of solder joints could be enhanced with ZnO nanoparticles [28]. ZnO nanoparticles also suppressed the growth of intermetallic compounds during soldering, for example, Cu 6 Sn 5 and Ag 3 Sn [25,29,30].…”

Section: Introductionmentioning

confidence: 99%

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

Kanlayasiri

Meesathien

2018

Advances in Materials Science and Engineering

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is research investigates the effects of zinc oxide (ZnO) nanoparticles of varying concentrations 0.0, 0.25, 0.50, 0.75, and 1.0 wt.% on the melting temperatures, wettability, printability, slump, and interfacial microstructure of the ZnO-doped Sn-0.3Ag-0.7Cu lead-free solder pastes on the copper substrate. e results revealed that the introduction of the ZnO particles had no effect on the solidus and liquidus temperatures of the solders. e maximum wettability was achieved with 0.25 wt.% ZnO nanoparticles, while the printability was inversely correlated with the nano-ZnO concentrations. e findings also indicated that, at room temperature, the slumping and the nano-ZnO concentrations were positively correlated and that, under the 150°C thermal condition, the maximum slumping was achieved with 0.25 wt.% ZnO. e slumping mechanism of the SAC0307-xZnO solder pastes is also provided herein. Moreover, the experiments showed that Cu 6 Sn 5 was the single intermetallic compound present in the interfacial layer between the solders and the copper substrate, with the maximum intermetallic layer thickness realized at the 0.25 wt.% ZnO concentration.

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Effect of ZnO nanoparticles addition on thermal, microstructure and tensile properties of Sn–3.5 Ag–0.5 Cu (SAC355) solder alloy

Cited by 34 publications

References 25 publications

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0wt% Sb–0.5wt% Cu lead-free solder alloy

Synthesis and Properties of Pulse Electrodeposited Lead-Free Tin-Based Sn/ZrSiO4 Nanocomposite Coatings

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead‐Free Solder Paste

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