Effect of working power and pressure on plasma properties during the deposition of TiN films in reactive magnetron sputtering plasma measured using Langmuir probe measurement

Enhancing the Properties of Photocatalysts via Nonthermal Plasma Modification: Recent Advances, Treatment Variables, Mechanisms, and Perspectives

“…Compared with the control and N­(H):STO, the N:STO processed at 600 W showed higher photocatalytic activity. Moreover, the effect of power on the electron density becomes more serious under relatively higher pressure . Increasing the pressure is meant to enhance the collision rate between electrons and atoms, resulting in enhanced ionization and dissociation rates.…”

“…Moreover, the effect of power on the electron density becomes more serious under relatively higher pressure. 85 Increasing the pressure is meant to enhance the collision rate between electrons and atoms, resulting in enhanced ionization and dissociation rates. How et al 85 reported a higher sputtered deposition under a higher working pressure using the same power.…”

“…85 Increasing the pressure is meant to enhance the collision rate between electrons and atoms, resulting in enhanced ionization and dissociation rates. How et al 85 reported a higher sputtered deposition under a higher working pressure using the same power. RF low-pressure inductively coupled plasma (ICP) was utilized to prepare Cu/CuS nanoparticle films under different power.…”