Effect of voids on the reliability of BGA/CSP solder joints

The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering

“…Based on the studies of void formation in Sn-Ag-Cu solder alloys on Cu substrate [2,5], it can be concluded that the characterization of voids is not negligible. By applying image analysis, the count and the area parameters were determined (Fig.…”

“…for the credible identification of 5-10 micron-sized voids [8]. Generally, the size, the count number and the area fraction of voids are examined in soldering bonds [8,9], but we have also found a study on the position of voids in BGA solder balls [5].…”

“…Unfortunately, voids significantly reduce the reliability of soldering bonds [5], partly because large voids decrease useful cross-sections. The main parameters and mechanisms of void formation are well-known [6], e.g.…”

Photovoltaic Concentrators - Fundamentals, Applications, Market & Prospective

“…The voids can produce cracking and failures during thermal cycling, as known in electronic technology. (Yunus et al, 2003). Bypass diodes are often mounted on the same substrate of the cells; for multijunctions solar cells these component assumes great importance due to the high sensitivity to reverse bias of these cells, protecting the devices against destructive reverse loads.…”

Flip Chip Bump Formation of Sn–1.8Bi–0.8Cu–0.6In Solder by Stencil Printing

“…Numerous studies have been conducted about the effect of voids. Among them, Yunus et al 17) showed that there is no significant difference in reliability between the solder joints with no voids and those with small voids (1-15% of the cross sectional area of the solder joint). Void diameters observed in this study ranged from 5 to 20 mm and were below 15% of the cross sectional area of the solder joint.…”