Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology

Zhou, Bin; Qiu, Baojun

doi:10.1109/eptc.2008.4763515

Cited by 9 publications

(5 citation statements)

References 5 publications

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“…If the voiding results presented in figures 4(a) and 4(b) are combined for all four solder pastes, it can be generally concluded that smaller solder bumps are more susceptible to voiding. While this finding poses a serious threat to the reliability of miniaturized electronics products, where solder joint sizes are continuously decreasing in size, recent studies have found that solder voiding could negative impact solder joint reliablity only when void desity is high [2] and void location was in the initial maxium stress region, such as crack path [2,4].…”

Section: Resultsmentioning

confidence: 99%

Quantitative Evaluation of Voids in Lead Free Solder Joints

Mallik

Njoku

Takyi

2015

AMM

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Voiding in solder joints poses a serious reliability concern for electronic products. The aim of this research was to quantify the void formation in lead-free solder joints through X-ray inspections. Experiments were designed to investigate how void formation is affected by solder bump size and shape, differences in reflow time and temperature, and differences in solder paste formulation. Four different lead-free solder paste samples were used to produce solder bumps on a number of test boards, using surface mount reflow soldering process. Using an advanced X-ray inspection system void percentages were measured for three different size and shape solder bumps. Results indicate that the voiding in solder joint is strongly influenced by solder bump size and shape, with voids found to have increased when bump size decreased. A longer soaking period during reflow stage has negatively affectedsolder voids. Voiding was also accelerated with smaller solder particles in solder paste.

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Section: Resultsmentioning

confidence: 99%

Quantitative Evaluation of Voids in Lead Free Solder Joints

Mallik

Njoku

Takyi

2015

AMM

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“…The study observed that spatial positioning of the voids and their spatial distribution are significant indices for the reliability of the solder joint. Zhou and Qiu [28] used sub-modelling technique to investigate the spatial representation effects of voids on thermal fatigue reliability of BGA package and arrived at similar conclusions as Yanus et al . The above studies show that the void morphology is a crucial design index in consideration of TIMs.…”

Section: Introductionmentioning

confidence: 65%

“…Some authors have considered the effect of void arrangements in thermo-mechanical response of the STIM layer [27,28]. This study also investigated the effect of void arrangement for the two realistic void morphologies numerically generated in this work.…”

Section: Effect Of Random Versus Ordered Void Arrangementmentioning

confidence: 98%

A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials

Okereke

2018

Applied Thermal Engineering

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Process-induced solder voids have three-dimensional shapes and show spatially random distribution with polydisperse geometric dimensions. There exists no analytical formulation of thermal resistances which incorporates void shapes, distribution and polydispersity variables. This paper uses finite element methods to investigate the effect of realistic void morphology on the thermal resistance of solder thermal interface materials (STIMs). The study has developed two computationally efficient methods for generating voids that show the features of real voids. Cylindrical and spherical void morphologies have been studied. The study is the first attempt, in literature, of characterizing the holistic effects of such realistic three-dimensional void morphologies on the thermal resistance of STIM layers. We have shown a qualitative agreement between our results and simplistic analytical predictions. However, the influence of void shapes, distribution and polydispersity have been shown to contribute to increased thermal resistances. The findings should provide significant insight to electrical/electronics engineers, micro-electronics chips manufacturers and academic research groups working on thermodynamics design of chip scale package (CSP) devices. It is also a framework for investigating objectively, the consequence of voids on the thermomechanical response of solder joints.

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“…Studies have shown that the presence of both large and small voids can reduce the lifespan of IGBT packages [25,26]. Additionally, the reliability of solder joints is directly linked to the percentage, position, and dispersion of voids [27,28]. In [14], it has been found that the wear life of the solder layer is inversely proportional to the percentage of voids present.…”

Section: Effect Of Solder Voids On the Thermal Behavior Of The Igbtsmentioning

confidence: 99%

Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach

Alavi,

De Ceuninck,

Daenen

2024

Electronics

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This study investigates the thermal behavior of Insulated Gate Bipolar Transistors (IGBTs) with a focus on the influence of solder voids within the device. Utilizing a combination of Finite Element Method (FEM) simulations, X-ray imaging, and SEM-EDX analysis, we accurately modeled the internal structure of IGBTs to assess the impact of void characteristics on thermal resistance. The findings reveal that the presence and characteristics of solder voids—particularly their size, number, and distribution—significantly affect the thermal resistance of IGBT devices. Experimental measurements validate the FEM model’s accuracy, confirming that voids disrupt the heat flow path, which can lead to increased thermal resistance and potential device failure. Five regression models, including Gaussian process regression (GPR) and neural networks, were employed to predict the thermal resistance based on void characteristics, with the GPR models demonstrating superior performance. The optimal GPR RQ model consistently provided accurate predictions with an RMSE of 0.0050 and R2 of 0.9728. Using the void percentage as the only input parameter for the regression models significantly impacted the prediction accuracy, showing the importance of the void extraction method. This study shows the necessity of minimizing solder voids and offers a robust methodological framework for a better prediction of the reliability of IGBTs.

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Effect of Voids on the Thermal Fatigue Reliability of PBGA Solder Joints through Submodel Technology

Cited by 9 publications

References 5 publications

Quantitative Evaluation of Voids in Lead Free Solder Joints

Quantitative Evaluation of Voids in Lead Free Solder Joints

A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials

Impact of Solder Voids on IGBT Thermal Behavior: A Multi-Methodological Approach

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