Effect of voids on the reliability of BGA/CSP solder joints

Yunus, M. A.; Primavera, A.; Srihari, K.; Pitarresi, James M.

doi:10.1109/iemt.2000.910730

Cited by 34 publications

(19 citation statements)

References 1 publication

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“…A slow ramp-up of 1.5 K/s was used to significantly improve the DT of the board-level by decreasing its average from 11.22 to 7.74 K. The bridging defects were eliminated, as shown in the optimal condition in Figure 12. Moreover, both conditions also showed that the voids remained less than 50 per cent of the Figure 10 Comparison of the initial and optimal reflow profiles of the coldest solder joint (Yunus et al, 2003). A fast cooling rate of 3 K/s during the initial condition not only causes internal cracking of the solder joints, but also causes interface delamination (Hu et al, 2010) between the FR-4 PCBs, as shown in Figure 13(a).…”

Section: Experimental Comparison With Initial Process Parameter Settingsmentioning

confidence: 90%

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

Abdullah

Khor

2013

Microelectronics International

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Purpose -Reflow soldering is one of the most significant factors in determining solder joint defect rate. This study aims to introduce an innovative approach for optimizing the multiple performances of the reflow soldering process. Design/methodology/approach -This study aims to minimize the solder joint defect rate of a ball grid array (BGA) package by using the grey-based Taguchi method. The entropy measurement method was employed together with the grey-based Taguchi method to compute for the weights of each quality characteristic. The Taguchi L18 orthogonal array was performed, and the optimal parameter settings were determined. Various factors, such as slope, temperature, and reflow profile time, as well as two extreme noise factors, were considered. The thermal stress, peak temperature, reflow time, board-and package-level temperature uniformity were selected as the quality characteristics. These quality characteristics were determined using the numerical method. The numerical method comprises the internal computational flow that models the reflow oven coupled with the structural heating and cooling models of the BGA assembly. The Multi-physics Code Coupling Interface was used as the coupling software. Findings -The analysis of variance results reveals that the cooling slope was the most influential factor among the multiple quality characteristics, followed by the soaking temperature and the peak temperature. Experimental confirmation test results show that the performance characteristics improved significantly during the reflow soldering process. Practical implications -The proposed approach greatly reduces solder joint defects and enhances solutions to lead-free reliability issues in the electronics manufacturing industry. Originality/value -The findings provide new guidelines to the optimization method which are very useful for the accurate control of the solder joint defect rate within components and printed circuit board (PCB) which is one of the major requirements to achieve high reliability of electronic assemblies.

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Section: Experimental Comparison With Initial Process Parameter Settingsmentioning

confidence: 90%

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

Abdullah

Khor

2013

Microelectronics International

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“…(2) We must let the gasses discharged from the molten solder. 5. Degassing mechanism Bubble Behavior in Molten Solder is shown as follows:…”

Section: Fig 6 Courses Contribute To Voids Formationmentioning

confidence: 99%

The Void-free Reflow Soldering of BGA with Vacuum

Wei-cheng

2007

2007 8th International Conference on Electronic Packaging Technology

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During reflow soldering of BGA, voids are very easily produced in the solder joints. Void formation in solder joints is one of the many critical factors governing the solder joint reliability. Voids may degrade the mechanical robustness of the board level interconnection and consequently affect the reliability, the electrical and thermal conducting performance of the solder joint. In order to avoid void formation in the solder joints during the reflow soldering of BGA, we must reduce oxidation of solder, the metallization of the substrate, component or the solder powder surface, decrease gas production during soldering, make gas degassing from molten solder easily. Vacuum reflow soldering technology can greatly satisfy the three requests. It has been proved that vacuum reflow solder technology is a valid technology for the void-free and lead-free soldering of BGA, not only can we use it to reflow solder BGA, But also to rework BGA with voids in solder joints.

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“…Big voids, especially greater than 50% of the solder joint area, decrease the mechanical robustness of the solder joints. However, there was no statistical significance of the effect of small voids on the mechanical robustness of solder joint [5]. In this study, maximum void size in one solder joint was used to identify the void class according to the international void classification standard (IPC-7095B) shown in table 3 [6].…”

Section: B Void Characterizationmentioning

confidence: 99%

Effect of reflow conditions on the die shear strength in flip chip on board with SAC305 solder joints

Zhou

Lin

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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Solder bump joint has been accepted as a main FCOB interconnection method so far. To optimize the process conditions for achieving SAC305 solder bumped FCOB assembly with maximum die shear strength and allowable void rate, an orthogonal experimental design of four factors and three levels was carried out. The optimal process conditions are: 100 seconds for preheating time, 245 o C for peak temperature, 60 seconds for time above liquidus, flux paste as the auxiliary material. Three fracture modes were observed and categorized for samples after shear test based on the fracture interface location. The most frequently occurring fracture mode is the ductile.

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Effect of voids on the reliability of BGA/CSP solder joints

Cited by 34 publications

References 1 publication

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

Optimization of the reflow soldering process with multiple quality characteristics in ball grid array packaging by using the grey‐based Taguchi method

The Void-free Reflow Soldering of BGA with Vacuum

Effect of reflow conditions on the die shear strength in flip chip on board with SAC305 solder joints

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