2015
DOI: 10.1039/c5ra03663a
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Effect of various encapsulants for frameless glass to glass Cu(In,Ga)(Se,S)2 photovoltaic module

Abstract: Cu(In,Ga)(Se,S)2 modules with a frameless glass to glass structure were fabricated by replacing the currently used EVA with new encapsulants, and their characteristics including optical, mechanical, and reliability properties were investigated.

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Cited by 16 publications
(16 citation statements)
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“…Increases in R S and R SH are also observed following the insertion of the barrier layer between the Mo layer and the SLG. The reduction in FF can be induced by variations in parasitic resistances, such as an increase in R S or a decrease in R SH , which are related to the electrical transport loss and the leakage current, respectively . Since the change in R S is consistent with that in FF, R S appears to be a more determinant factor in the dramatic variation in the FF.…”
Section: Resultsmentioning
confidence: 99%
“…Increases in R S and R SH are also observed following the insertion of the barrier layer between the Mo layer and the SLG. The reduction in FF can be induced by variations in parasitic resistances, such as an increase in R S or a decrease in R SH , which are related to the electrical transport loss and the leakage current, respectively . Since the change in R S is consistent with that in FF, R S appears to be a more determinant factor in the dramatic variation in the FF.…”
Section: Resultsmentioning
confidence: 99%
“…The next step is the module assembly, which assumes the same encapsulation scheme, for all three technologies (silicon, perovskite and tandem), although it is likely that a thin‐film perovskite module would be eventually produced rather differently to current silicon modules. For example, ethyl vinyl acetate would not be required in glass–glass encapsulation scheme , but a sealant technology will be required, and cell interconnection for thin‐film modules is usually very different to that for silicon wafer cells. It is already shown that there is a possibility of making solar modules with these tandem solar cells using the same materials as the silicon .…”
Section: Methodsmentioning
confidence: 99%
“…Such glass-to-glass packages can also employ edge seals to further prevent moisture from entering the module. This type of packaging is however, much more common for alternative PV technologies in which moisture is much more detrimental to the cells [97]. There is also evidence to suggest a glass back cover may induce more strain within the cell interconnects affecting reliability [98].…”
Section: Backsheetmentioning
confidence: 99%