Abstract:Sn-xCu (x = 0.5, 0.7, 0.9, 1.1, 1.3) solders were prepared to investigate the in uence of trace Cu on the microstructure, the spreadability and the oxidation resistance property of Sn-xCu lead-free solder. Researches have shown that the Cu content had a signi cant impact on the microstructure, the microstructure of Sn-0.7Cu solder was almost ne dendrites and others were composed of coarser dendrites. The liquidus temperatures of Sn-xCu were around 227 C, the peak of solidi cation temperature had vast differenc… Show more
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