Effect of TiN/C Microstructure Composite Layer on the Adhesion of FDLC Film onto Silicon Substrate

Xiao, Jianrong; Gong, Chunhui; Qi, Meng; Jiang, Aihua; Wang, Zhiyong; Li, Ming; Ma, Jiafeng

doi:10.3390/coatings8010018

Cited by 9 publications

(4 citation statements)

References 42 publications

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“…The peak at 401.2 eV belongs to N-O, which is related to the oxygen adsorption on the samples surface. 29 Nitrogen content increases with the increase of nitrogen gas flow, as shown in Fig. 5d.…”

Section: Results and Disscusionmentioning

confidence: 74%

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

Wang¹,

Qiu²,

Lin³

et al. 2022

J. Electrochem. Soc.

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Copper (Cu), Nitrogen (N) Co-doped diamond-like carbon ((Cu:N)-DLC) films and Cu-doped DLC (Cu-DLC) films were fabricated by high-power impulse magnetron sputtering technique (HiPIMS). The influence of copper and nitrogen incorporation on the microstructure and electrochemical properties of Cu-DLC and (Cu:N)-DLC films were investigated by X-ray photoelectron spectroscopy, raman spectra, and electrochemical workstation. The surface of all of the films is cauliflower-like clusters, no obvious large particle Cu clusters can be observed. XRD patterns of theses films have only diffraction peak of copper and no other compounds. Raman spectra illustrate that Id/Ig varies from 2.79 to 3.01 as the N contents changes. XPS results identify that Cu does not form compounds or solid solution into DLC films. Electrochemical tests show that the electrode activity gradually increases with increasing the N contents of (Cu:N)-DLC electrode. Compared with (Cu:N)-DLC electrode, Cu-DLC electrode has a faster electron transfer rate (K0 is 1.88×10-2cms-1), low transfer resistance (227.0 Ωcm2), and a higher electrochemical activity (ΔEp is 93mV). Consequently, the electrochemical properties of Cu-doped DLC films are better than that of Cu, N co-doped DLC films.

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Section: Results and Disscusionmentioning

confidence: 74%

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

Wang¹,

Qiu²,

Lin³

et al. 2022

J. Electrochem. Soc.

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“…Useful asymptotics solutions have been derived in Equations (14)- (22) for stiff layers over soft substrates, where α → 1 or E 1 /E 2 → ∞ , e.g., metal coatings on elastomers, and for soft layers over stiff substrates, where α → −1 or E 1 /E 2 → 0 , e.g., polymer coatings over metals; furthermore, intermediate expansions have been derived for near-homogeneous problems.…”

Section: Discussionmentioning

confidence: 99%

“…The relative error is below 1% for E 1 /E 2 ≥ 200 (α ≥ 0.99) in Equation (20), for E 1 /E 2 ≤ 0.6 (α ≤ −0.25) in Equation (21), and for 0.4 ≤ E 1 /E 2 ≤ 2.1 (−0.44 ≤ α ≤ 0.36) in Equation (22). The equations can be used with confidence for all values of α outside the interval 0.36 < α < 0.99 where the exact analytical solutions in Equations (10) and (A2), or the results in Table 5, should be applied.…”

mentioning

confidence: 94%

“…The decohesion of polymer coatings used to protect metals for different applications, e.g., in beverage or food cans, biomedical and mechanical devices, or with anti-fouling functionality, leads to the loss of the protective and aesthetic properties of the coatings [20,21]. Many other thin film applications depend on the adhesion of the film to the substrate [22][23][24].…”

Section: Introductionmentioning

confidence: 99%

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Fracture Mechanics Solutions for Interfacial Cracks between Compressible Thin Layers and Substrates

et al. 2019

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The decohesion of coatings, thin films, or layers used to protect or strengthen technological and structural components causes the loss of their functions. In this paper, analytical, computational, and semi-analytical 2D solutions are derived for the energy release rate and mode-mixity phase angle of an edge-delamination crack between a thin layer and an infinitely deep substrate. The thin layer is subjected to general edge loading: axial and shear forces and bending moment. The solutions are presented in terms of elementary crack tip loads and apply to a wide range of material combinations, with a large mismatch of the elastic constants (isotropic materials with Dundurs’ parameters − 1 ≤ α ≤ 1 and − 0.4 ≤ β ≤ 0.4 ). Results show that for stiff layers over soft substrates ( α → 1 ), the effects of material compressibility are weak, and the assumption of substrate incompressibility is accurate; for other combinations, including soft layers over stiff substrates ( α → − 1 ), the effects may be relevant and problem specific. The solutions are applicable to edge- and buckling-delamination of thin layers bonded to thick substrates, to mixed-mode fracture characterization test methods, and as benchmark cases.

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Effects of reinforcements and gamma‐irradiation on wear performance of ultra‐high molecular weight polyethylene as acetabular cup liner in hip‐joint arthroplasty: A review

Nayak

Balani

2021

J of Applied Polymer Sci

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Improving the wear resistance of ultra‐high molecular weight polyethylene (UHMWPE), the gold standard polymer for acetabular component in hip joint arthroplasty, is the most important challenge in joint arthroplasty. The possible ways that have been approached to this challenge are by: (i) engineering multi‐phase that is, both carbonaceous and noncarbonaceous fillers‐based polyethylene composites, which unite the inherent attributes of each element available in the system. The wear rate of carbonaceous composite is nearly 50% lower (5.11–6.69 × 10−5 mm3/Nm) than that of noncarbonaceous composite (10–12.5 × 10−5 mm3/Nm), thus, recognized as a potential reinforcement, and (ii) coupling gamma‐irradiation, which is a mandated sterilization process, with multi‐phase nanocomposite to understand the free radical‐scavenging effect of fillers and improved interfacial adhesion strength between fillers and matrix. After the exposure of gamma‐rays (50–100 kGy), the free radicals formed by bond breakage in both the reinforcements and the matrix recombine to form covalent/Van der Waals bond in the interface. Thus, dramatical improvement in wear resistance of both types of composites with 2–4 times decreased wear rate is observed compared to that of composites under un‐irradiated condition. However, enhancing the interfacial adhesion between two different phases is a major constraint in the design of UHMWPE composites. Many methods such as functionalization of reinforcements, and irradiation on functionalized UHMWPE composites that can be approached to address this constraint are documented in this review.

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Effect of TiN/C Microstructure Composite Layer on the Adhesion of FDLC Film onto Silicon Substrate

Cited by 9 publications

References 42 publications

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

Fracture Mechanics Solutions for Interfacial Cracks between Compressible Thin Layers and Substrates

Effects of reinforcements and gamma‐irradiation on wear performance of ultra‐high molecular weight polyethylene as acetabular cup liner in hip‐joint arthroplasty: A review

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