Effect of Ti addition on the mechanical properties of high temperature Pb-free solders Zn–25Sn–xTi

Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te

“…For a certain class of SAC solders, the formation of Cu 6 Sn 5 intermetallic (IMC) precipitates during eutectic solidification is correlated with an increase in Ag content and coarse primary Ag 3 Sn IMC. An additional class of SAC alloys depends on the creation of strengthening IMCs during solidification, wherein microalloying elements like Sb [4], In [5], Ti [6], Ni [7], and Al [8] are added to stabilize Ag 3 Sn and Cu 6 Sn 5 , which ordinarily coarsen rapidly. Therefore, when recalling any kind of strengthening phase, the thermally stabilized precipitates are needed to delay the loss of strength and slow the coarsening rates [9].…”