2018 IEEE International Interconnect Technology Conference (IITC) 2018
DOI: 10.1109/iitc.2018.8430465
|View full text |Cite
|
Sign up to set email alerts
|

Effect of Thermal Annealing on Low-K Dielectrics for iBEOL in View of 3D Sequential Integration

Abstract: Conclusion Annexes Liste des symboles Glossaire Liste des figures Liste des tableaux « Le secret du bonheur consiste à s'accommoder de toutes les catastrophes. »

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Publication Types

Select...

Relationship

0
0

Authors

Journals

citations
Cited by 0 publications
references
References 25 publications
0
0
0
Order By: Relevance

No citations

Set email alert for when this publication receives citations?