2013
DOI: 10.1016/j.jphotochem.2012.10.011
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Effect of the spectral properties of TiO2, Cu, TiO2/Cu sputtered films on the bacterial inactivation under low intensity actinic light

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Cited by 49 publications
(41 citation statements)
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“…Cu-sputtered for 40 s by DCMSP inactivated E. coli under the same light within 1 hour. When sputtering TiO 2 for 10 min followed by sputtering of Cu-layers for 40 s, the composite film inactivated E. coli within less than 5 min under the same light [56] showing the beneficial synergic action of TiO 2 and Cu accelerating the E. coli inactivation kinetics. In the dark the E. coli inactivation for the sample CuO x /TiO 2 was reported to occur within 30 min.…”
Section: Cu Coupled With Tio 2 Sputtered Surfaces Active In the Visibmentioning
confidence: 98%
“…Cu-sputtered for 40 s by DCMSP inactivated E. coli under the same light within 1 hour. When sputtering TiO 2 for 10 min followed by sputtering of Cu-layers for 40 s, the composite film inactivated E. coli within less than 5 min under the same light [56] showing the beneficial synergic action of TiO 2 and Cu accelerating the E. coli inactivation kinetics. In the dark the E. coli inactivation for the sample CuO x /TiO 2 was reported to occur within 30 min.…”
Section: Cu Coupled With Tio 2 Sputtered Surfaces Active In the Visibmentioning
confidence: 98%
“…After the eighth cycle, Figure 4 shows Cu was released at ppb levels <8 ppb. These Cu-levels are not considered cytotoxic to mammalian cells [150,166]. Figure 5 shows a concomitant lower release of 8 ppb Ti-ions during bacterial disinfection, which dropped to about 4 ppb after the eighth cycle.…”
Section: Current Work On Tio2/cu Sputtered Surfaces By Dcms Dcmsp Amentioning
confidence: 94%
“…After the eighth cycle, Figure 4 shows Cu was released at ppb levels <8 ppb. These Cu-levels are not considered cytotoxic to mammalian cells [150,166]. TiO2/Cu cotton samples increased the E. coli inactivation kinetics with the increase of the applied light intensity [166].…”
Section: Current Work On Tio2/cu Sputtered Surfaces By Dcms Dcmsp Amentioning
confidence: 95%
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“…The amount of Cu + -ions increases with HIPIMS at 6 Amps to reach 97% along 3% Ar 2+ . Finally, at 60 Amps the composition of the gas phase is: 17% Ar + , 3% Ar 2+ , 75% Cu + and 5% Cu 2+ [41,42]. Because of the different power applied by HIPIMS the ion trajectory in the plasma and subsequent condensation on the substrate surface proceed with a different diffusion and condensation in the case of HIPIMS compared to DCMS.…”
Section: E Coli Inactivation Kinetics and Mechanism On Cu-polyester mentioning
confidence: 99%