Effect of the shape and the distribution of cells on the effective thermal conductivity of polyurethane foam

Hermama, C.; Bensiali, B.; Lahbabi, Salma; Maliki, A. El

doi:10.1002/pen.26376

Cited by 5 publications

(3 citation statements)

References 69 publications

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“…35 The construction of a 3D heat transfer skeleton in polymers can provide materials with low interfacial thermal resistance and rapid heat dissipation channels, but the efficiency of forming a thermal conductivity network with a single filler remains low, and the increase in thermal conductivity of composite materials is extremely limited. [36][37][38][39][40] We decided to incorporate an additional type of filler into the 3D skeleton, creating a dual filler, thermally conductive network. This approach has resulted in an effective improvement in thermal conductivity due to the synergistic effect of the two fillers.…”

Section: Introductionmentioning

confidence: 99%

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Zhu,

Ren,

Chen

et al. 2024

Polymer Engineering & Sci

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High thermally conductive polymer composites have garnered significant attention due to their exceptional performance, given the ever‐decreasing size of electronic devices and the rise in power densities. Herein, a new three‐dimensional (3D) thermal conductivity network structure has been successfully prepared using double fillers of nickel foam (NF) and modified silicon carbide particles (KSiC). The study compared the effect of different filler contents on the thermal conductivity of composites. Compared to conventional composites, those based on 3D filling networks have significantly improved thermal conductivity. The thermal conductivity of the NF/KSiC/PU composite containing 50 wt% KSiC was 1.18 Wm−1 K−1, exceeding the cumulative thermal conductivity of the NF/PU and KSiC/PU 50 wt% composites, and 637.5% greater than that of neat PU. Meanwhile, the synthesized NF/KSiC/PU composite maintained a high electrical resistivity above 1012 Ω·cm and good mechanical properties. This approach might offer novel solutions for developing high‐quality packaging materials for advanced electronic devices with exceptional thermal and mechanical properties.Highlights Using SiC and NF Constructs a dual filler network. The dual filler thermal conductivity network can generate synergistic effects. Improving thermal conductivity compared to original polyurethane. Maintaining a high electrical resistivity and good mechanical properties.

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Section: Introductionmentioning

confidence: 99%

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Zhu,

Ren,

Chen

et al. 2024

Polymer Engineering & Sci

View full text Add to dashboard Cite

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“…Therefore, to avoid the accumulation of excessive heat in localized areas of the devices, which could cause irreversible damage, improve device safety, and extend their lifespan, the demand for high thermal conductive materials in related fields is increasing. [1][2][3][4][5][6][7][8][9] Silicone rubber (SR) is widely used due to its excellent insulating and shock-absorbing properties, but its thermal conductivity is only around 0.2 W m À1 K À1 . [10][11][12] However, by incorporating high-performance thermal conductive fillers into the matrix, such as boron nitride (BN), [13][14][15] silicon carbide (SiC [16][17][18] ), aluminum oxide (Al 2 O 3 [19][20][21][22] ), as insulating thermal conductive fillers, and materials like graphite, [23][24][25] carbon nanotubes (CNT [26][27][28][29][30] ), as conductive and insulating fillers, the thermal conductivity of SR can be effectively improved.…”

Section: Introductionmentioning

confidence: 99%

“…With the advancement of electronic information technology, electronic devices are becoming more powerful while their size is getting smaller. Therefore, to avoid the accumulation of excessive heat in localized areas of the devices, which could cause irreversible damage, improve device safety, and extend their lifespan, the demand for high thermal conductive materials in related fields is increasing 1–9 . Silicone rubber (SR) is widely used due to its excellent insulating and shock‐absorbing properties, but its thermal conductivity is only around 0.2 W m −1 K −1 10–12 .…”

Section: Introductionmentioning

confidence: 99%

Preparation of continuous carbon fiber‐filled silicone rubber with high thermal conductivity through wrapping

Zhang,

Qiu,

Sakai

et al. 2023

Polymer Composites

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With the development of electronics, there is an increasing demand for high‐performance heat‐dissipation materials in electronic devices. Thermal conductive silicone rubber (SR) has received significant attention in related industries due to its excellent mechanical flexibility and high thermal conductivity. However, the intrinsic thermal conductivity of SR is low, necessitating the addition of thermal conductive fillers to meet the usage requirements. Common thermal conductive fillers typically exist in powder form and require such surface modification and orientation, which increases production costs and poses challenges for large‐scale production. In this study, continuous carbon fibers (CFs) are utilized as fillers. By employing a simple pre‐infiltration and winding method, CFs are uniformly distributed in SR, aligning parallel. The CFs not only serve as thermal conductive pathways but also maintain their orientation distribution within the substrate. Furthermore, by pre‐adding boron nitride (BN) to the SR, the thermal conductivity of SR is enhanced, and BN is distributed along the fibers, further improving the enhancement effect of BN on the thermal conductivity of SR. When CF content reaches 30 vol%, the thermal conductivity of CF/BN/SR composite reaches 2.789 W m−1 K−1. Moreover, by using BN/SR before curing as a coating, it can be applied to the surface of the CF/BN/SR composite. This greatly increases the volume resistivity of the material (>1014 Ω cm) while maintaining the thermal conductivity of the composite. Using continuous fibers as fillers also enables easier implementation of mass production in the preparation of thermal conductive SR.Highlights Prepare continuous carbon fiber and boron nitride (BN)‐filled composite through mechanical winding; The carbon fiber (CF)/BN/silicone rubber (SR) composite exhibits high thermal conductivity; Improve the enhancement of BN on the TC of SR by aligning the BN along the CF; BN/SR used as insulating coating by incremental curing.

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Fabrication of flat and sizeable nanocellular polymethyl methacrylate (PMMA) foam with tunable thermal conductivity

Gebremedhin,

Tolcha,

Yeh

2024

Polymer Engineering & Sci

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Polymeric nanocell foam is a promising material that faces manufacturing challenges. Producing sizable and thick foams for properties testing has been challenging. This study aims to scale up and understand the foaming mechanism of nanocellular foams by controlling the saturation temperature, pressure, and molecular weight distribution of the matrix to fine‐tune the glass transition temperature of the polymer/gas mixture. The hot‐press foamed samples possess a 100 × 70 × 6 ~ 8 mm3 dimension and a cell size of less than 200 nm. Bimodal structures can also be created by controlling the critical processing parameters. Introducing 37% microcells into unimodal nanocellular foam reduced the relative density from 0.29 to 0.19. The thermal conductivity of the foams was tuned by controlling the cell size distribution. Unimodal nanofoams have the lowest thermal conductivity for foams of the same density due to the Knudsen effect and tortuosity. The measured thermal conductivity is in agreement with theoretical models.Highlights PMMA nanofoam with a dimension of 100 × 70 × 6–8 mm3 and cell size below 200 nm. The morphology of nanofoams was tuned to be unimodal and bimodal. The foam density of the bimodal nanofoams was lowered below 0.238 g/cm3. The thermal conductivity of foams was tuned by controlling the cell structure.

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Effect of the shape and the distribution of cells on the effective thermal conductivity of polyurethane foam

Cited by 5 publications

References 69 publications

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Three‐dimensional skeleton assembled by nickel foam/silicon carbide as filler in polyurethane composites with high thermal conductivity and electrical insulation

Preparation of continuous carbon fiber‐filled silicone rubber with high thermal conductivity through wrapping

Fabrication of flat and sizeable nanocellular polymethyl methacrylate (PMMA) foam with tunable thermal conductivity

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