1999
DOI: 10.1163/156856199x00497
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Effect of the rheological properties of industrial hot-melt and pressure-sensitive adhesives on the peel behavior

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Cited by 41 publications
(19 citation statements)
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“…For example, it may be concluded that soywax would be a good candidate to replace NWA in applications where fluidity is required at lower temperatures, or alternately, that NWA can replace soywax where comparable viscosities are required at higher temperatures. Melt viscosity is an important consideration in applications such as hot melt adhesives, where a specific melt viscosity range is required to uniformly extrude and apply an adhesive and work the surfaces together into the desired geometry before curing begins .…”
Section: Resultsmentioning
confidence: 99%
“…For example, it may be concluded that soywax would be a good candidate to replace NWA in applications where fluidity is required at lower temperatures, or alternately, that NWA can replace soywax where comparable viscosities are required at higher temperatures. Melt viscosity is an important consideration in applications such as hot melt adhesives, where a specific melt viscosity range is required to uniformly extrude and apply an adhesive and work the surfaces together into the desired geometry before curing begins .…”
Section: Resultsmentioning
confidence: 99%
“…On the first question, it has been shown that the shift in time of certain characteristic relaxation times of a polymer led to a shift of the same magnitude in the debonding rate at which a transition from cohesive to adhesive failure was observed in peel tests, implying therefore that the rheological properties of the adhesive control its adhesive behavior. [49,50] On the second question, however, a direct prediction of r max , e max or W from the small-strain viscoelastic properties and a surface property such as the surface tension of the substrate is currently not possible. According to recent studies, [24,51,52] a quantitative prediction of peel forces of fibrillating adhesives requires data on the elongational properties of these polymers.…”
Section: Discussionmentioning
confidence: 99%
“…Table I lists some families of PSA with some selected experimental references focusing on those families of adhesives. (Nakajima, 1992, Gibert et al, 1999, Daoulas et al, 2004 Silicones It is worthwhile now to translate the physical and rheological properties that are required to display adhesion into polymer chain architecture. Since the modulus must be below 0.1 MPa at 1…”
Section: Materials Used For Pressure-sensitive-adhesivesmentioning
confidence: 99%