Effect of the particle distribution on the mechanisms controlling deformation of a copper alloy at intermediate temperatures

Morris, M.A.; Joye, J.C.

doi:10.1016/0956-7151(95)90263-5

Cited by 14 publications

(3 citation statements)

References 15 publications

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“…[15][16][17][18][19][20] (31 -80% Cold Work) Figure 3 -Temperature effect on the yield strength of Cu-Cr-Zr alloys [5,21] Figure 4 -Steady-state thermal creep laws for copper alloys [11,14,[23][24][25][26][27][28][29][30] Figure 6 -Cyclic stress-strain curves of copper alloys at ambient temperature [36,38] Figure 7(a) -Fatigue lifetime of copper alloys, based on total strain amplitude [3,6,8,42] Cu-Cr-Zr at 216 °C (Thomas, 1993) Cu-Cr-Zr at 300 °C (Taubenlat, 1984) Cu-Cr-Zr at 300 °C (Gorynin et al, 1992) GlidCop Al15 at 400 °C (Stephens et al, 1988) GlidCop Al15 at 472 °C (Broyles et al, 1996) Applied Stress (ksi) Figure 4 -Steady-state thermal creep laws for copper alloys [11,14,[23][24][25][26][27][28][29][30] 0.001 Figure 6 -Cyclic stress-strain curves of copper alloys at ambient temperature [36,38] …”

Section: List Of Figuresmentioning

confidence: 99%

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Modeling creep and fatigue of copper alloys

Thomas

Stubbins

2000

Metall Mater Trans A

115

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This paper reviews expressions to quantify thermal creep and fatigue lifetime for four copper alloys, Cu-Ag-P, Cu-Cr-Zr, Cu-Ni-Be and Cu-Al 2 O 3 . These property models are needed to simulate the mechanical behavior of structures with copper components that are subjected to high heat flux and fatigue loading conditions, such as molds for the continuous casting of steel and the first wall in a fusion reactor. Then, measurements of four-point bending fatigue tests were conducted on two-layered specimens of copper alloy and stainless steel, and thermal ratchetting behavior was observed at 250 °C. The test specimens were modeled with a two-dimensional elastic-plastic-creep finite-element model using ABAQUS. To match the measurements, a primary thermal creep law was developed for Cu-0.28% Al 2 O 3 for stress levels up to 500 MPa, and strain rates from 10 -8 -10

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Section: List Of Figuresmentioning

confidence: 99%

“…For a given material, the creep rate depends strongly on the applied temperature and stress level, [11,14,[23][24][25][26][27][28][29][30] . In constructing the curve fits, Q and n values were adopted if they were reported, but all of the A values had to be calculated in this work.…”

Section: Thermal Creepmentioning

confidence: 99%

Modeling creep and fatigue of copper alloys

Thomas

Stubbins

2000

Metall Mater Trans A

115

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“…In particular, the high electrical and thermal conductivity of this alloy has been used for many applications such as trolley wire, electrode for resistance welding and lead frame materials [2,3]. Extensive investigations on the mechanical and electrical properties and microstructure have been carried out for the alloys during the last decade [4][5][6][7][8][9][10][11][12][13][14].…”

Section: Introductionmentioning

confidence: 99%

Microsture and Properties of a Cu-Cr-Zr-Fe-Ti Alloy

Huang

2015

AMM

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The effect of 0.45 wt. % Fe and 0.2 wt. % Ti additions on the age hardening behavior of Cu-Cr-Zr-Zn alloys has been investigated with respect to hardness, electrical conductivity and microstructure. It was showed that the addition of Fe /Ti to Cu-Cr-Zr-Zn alloys enhance strength and hardness, but decrease the electrical conductivity, and increase the aging temperature and time for attaining peak hardness. The scanning electron microscope (SEM) and transmission electron microscopy (TEM) results showed that there are four types of phases in the alloy, Cu-matrix, Cr-rich, (Cu,Zr)-rich and (Fe,Ti)-rich phases.

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Microstructural features and properties of high-hardness and heat-resistant dispersion strengthened copper by reaction milling

Yan

Chen

Cui

et al. 2011

J. Wuhan Univ. Technol.-Mat. Sci. Edit.

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The oxide dispersion strengthened copper alloys are attractive due to their excellent combination of thermal and electrical conductivities, high-temperature strength and microstructure stability. To date, the state-of-art to fabrication of them was the internal oxidation (IO) process. In this paper, alumina dispersion strengthened copper (ADSC) powders of nominal composition of Cu-2.5 vol%Al 2 O 3 were produced by reaction milling (RM) process which was an in-situ gas-solid reaction process. The bulk ADSC alloys for electrical and mechanical properties investigation were obtained by sintering and thereafter hot extrusion. After the hot consolidation processes, the fully densifi ed powder compacts can be obtained. The single γ-Al 2 O 3 phase and profile broaden effects are evident in accordance with the results of X-ray diffraction (XRD); the HRB hardness of the ADSC can be as high as 95; the outcomes should be attributed to the pinning effect of nano γ-Al 2 O 3 on dislocations and grain boundaries in the copper matrix. The electrical conductivity of the ADSC alloy is 55%IACS (International Annealing Copper Standard). The room temperature hardness of the hot consolidated material was approximately maintained after annealing for 1 h at 900 ℃ in hydrogen atmosphere. In terms of the above merits, the RM process to fabricating ADSC alloys is a promising method to improve heat resistance, hardness, electrical conductivity and wear resistance properties etc.

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Effect of the particle distribution on the mechanisms controlling deformation of a copper alloy at intermediate temperatures

Cited by 14 publications

References 15 publications

Modeling creep and fatigue of copper alloys

Modeling creep and fatigue of copper alloys

Microsture and Properties of a Cu-Cr-Zr-Fe-Ti Alloy

Microstructural features and properties of high-hardness and heat-resistant dispersion strengthened copper by reaction milling

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