2021
DOI: 10.3390/en14196287
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Effect of the Heat Dissipation System on Hard-Switching GaN-Based Power Converters for Energy Conversion

Abstract: The design of a cooling system is critical in power converters based on wide-bandgap (WBG) semiconductors. The use of gallium nitride enhancement-mode high-electron-mobility transistors (GaN e-HEMTs) is particularly challenging due to their small size and high power capability. In this paper, we model, study and compare the different heat dissipation systems proposed for high power density GaN-based power converters. Two dissipation systems are analysed in detail: bottom-side dissipation using thermal vias and… Show more

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Cited by 7 publications
(5 citation statements)
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References 58 publications
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“…Each GaN e-HEMT has only an external gate resistance of 10 Ω, the deadtime is 60 ns, and their junction temperatures are 90 ºC. The PLECS software calculates the losses according to the thermal datasheet and the equations provided by the manufacturer [42], [43].…”
Section: Simulation Resultsmentioning
confidence: 99%
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“…Each GaN e-HEMT has only an external gate resistance of 10 Ω, the deadtime is 60 ns, and their junction temperatures are 90 ºC. The PLECS software calculates the losses according to the thermal datasheet and the equations provided by the manufacturer [42], [43].…”
Section: Simulation Resultsmentioning
confidence: 99%
“…This prototype has been designed to work with power ratings of up to 5 kW. A detailed explanation of the design of the converter, including an analysis of the parasitic inductances, can be found in [43]. On the ac side, there was a three-phase series-connected RL load with R = 45. supplies the GaN converter.…”
Section: Resultsmentioning
confidence: 99%
“…Each GaN e-HEMT has only an external gate resistance of 10 Ω, the deadtime is 60 ns, and their junction temperatures are 90 °C. The PLECS software calculates the losses according to the thermal datasheet and the equations provided by the manufacturer (Plexim GmbH, 2019;Lumbreras et al, 2021). Appendix A details the equations and procedure used to obtain the converter losses.…”
Section: Simulation Resultsmentioning
confidence: 99%
“…Table 2.13 shows that SiC exhibits the highest thermal conductivity, while the thermal conductivity of GaN devices is the lowest. The low thermal conductivity of GaN e-HEMTs, combined with their high power density and small size, makes thermal dissipation extremely difficult in GaN-based power converters (Lumbreras et al, 2021). Inadequate thermal management can increase the junction temperature and, thus, reduce efficiency and even cause device destruction.…”
Section: Wide-bandgap Power Convertersmentioning
confidence: 99%
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