Effect of the distribution state of transition phase on the mechanical properties and failure mechanisms of the W–Mo–Cu alloy by tuning elements content

Cao, Jianjing; Liu, Jinxu; Liu, Xingwei; Li, Shukui; Xue, Xiaopeng

doi:10.1016/j.jallcom.2020.154333

Cited by 21 publications

(7 citation statements)

References 38 publications

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“…40. [149] With increasing Mo content from 12 to 34 wt%, the TP layer network can be gradually formed.…”

Section: Distribution Of Dispersion Strengthening Phasementioning

confidence: 97%

“…For W-Cu composites, the strengthening phase is mainly distributed in the grain boundary of W or W/Cu phase boundary, [149] and the strengthening effect is mainly achieved by the pinning [140] Copyright 2023, Open Access. 40.…”

Section: Distribution Of Dispersion Strengthening Phasementioning

confidence: 99%

“…In the aspect of W/Cu interface strengthening, some scholars put forward adding active elements such as Co, Fe, Ni, Cr, and Zr to enhance the interface bonding strength of W and Cu to strengthen W-Cu composites from the perspective of wettability between W and Cu. [149] Copyright 2020, Elsevier. Reproduced with permission.…”

Section: Interface Strengtheningmentioning

confidence: 99%

“…For W–Cu composites, the strengthening phase is mainly distributed in the grain boundary of W or W/Cu phase boundary, [ 149 ] and the strengthening effect is mainly achieved by the pinning effect of nanodispersed particles at the grain boundary or phase boundary. Cao et al declared that a transition phase (TP) layer between W and Cu phase can be formed through adding Mo, as shown in Figure .…”

Section: Strengthening Mechanismsmentioning

confidence: 99%

mentioning

confidence: 99%

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Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism

Zhang,

Yang,

Huang

et al. 2023

Adv Eng Mater

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Tungsten–copper (W–Cu) composite is a pseudoalloy prepared by powder metallurgy method with tungsten and copper as the main components, which are widely used in electrical contacts, electrical discharge machining electrodes, electronic packaging, aerospace, and military fields due to its good conductivity, thermal conductivity, high melting point, high electrical breakdown strength, low contact resistance, high welding resistance, and high heat resistance. Herein, the recent advances of W–Cu composites are reviewed systematically. First, the preparative techniques of W–Cu composites are introduced in detail, and their advantages and disadvantages are evaluated objectively. Second, an introduction of the main application fields and corresponding characteristics advantages for W–Cu composites are provided. Subsequently, the densification techniques and strengthening mechanisms and their effects on microstructure, mechanical properties, and physical properties of W–Cu composites are mainly discussed. Finally, based on a comprehensive review of W–Cu composites, its future development trends and potential research challenges are summarized and prospected.

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“…40. [149] With increasing Mo content from 12 to 34 wt%, the TP layer network can be gradually formed.…”

Section: Distribution Of Dispersion Strengthening Phasementioning

confidence: 97%

Section: Distribution Of Dispersion Strengthening Phasementioning

confidence: 99%

Section: Interface Strengtheningmentioning

confidence: 99%

Section: Strengthening Mechanismsmentioning

confidence: 99%

mentioning

confidence: 99%

See 3 more Smart Citations

Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism

Zhang,

Yang,

Huang

et al. 2023

Adv Eng Mater

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Microstructure and properties of tungsten‐40 wt.–% copper composites fabricated by binder jet 3D printing

Tian,

Sun,

et al. 2024

Materialwissenschaft Werkst

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In this work, the tungsten‐copper composites were fabricated by binder jet 3D printing technology. The effects of different printing layer thicknesses (50 μm to 100 μm) on the green density and green strength were investigated. Then, under the optimal layer thickness, the effects of different sintering temperatures (1300 °C to 1600 °C) on the microstructure and densification of tungsten‐40 wt.–% copper composites were studied. The experimental results showed that when the printing layer thickness was set as a lower value (50 μm), the tungsten‐40 wt.–% copper green part had the best strength and its density reached a maximum value of 60.73 %. After sintering for green parts printed with 50 μm layer thickness, the relative density, thermal conductivity and electrical conductivity of sintered parts first increased and then decreased with increasing sintering temperature. In our experiments, the tungsten‐40 wt.–% copper sample fabricated by binder jet 3D printing with a printing layer thickness of 50 μm under a sintering temperature of 1500 °C displayed the best properties, in which the relative density, thermal conductivity and electrical conductivity were 97.04 %, 228 W⋅m−1⋅K−1 and 46.5 % IACS, respectively.

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Preparation and properties of Al2O3 dispersed fine-grained W-Cu alloy

Zhang

Liu

et al. 2022

Advanced Powder Technology

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Effect of the distribution state of transition phase on the mechanical properties and failure mechanisms of the W–Mo–Cu alloy by tuning elements content

Cited by 21 publications

References 38 publications

Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism

Recent Advances in W–Cu Composites: A Review on the Fabrication, Application, Property, Densification, and Strengthening Mechanism

Microstructure and properties of tungsten‐40 wt.–% copper composites fabricated by binder jet 3D printing

Preparation and properties of Al2O3 dispersed fine-grained W-Cu alloy

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